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SY10EL16VAKG-TR

SY10EL16VAKG-TR

Manufacturer No:

SY10EL16VAKG-TR

Manufacturer:

Microchip Technology

Description:

IC RCVR DIFF 3.3/5V 8MSOP

Datasheet:

Datasheet

Delivery:

Payment:

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SY10EL16VAKG-TR Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-MSOP
  • Package / Case
    8-TSSOP, 8-MSOP (0.118", 3.00mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Number of Bits
    1
  • Supply Voltage
    3.3V, 5V
  • Logic Type
    Differential Receiver
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Discontinued at Digi-Key
  • Series
    10EL
The PI3B32x245BEx series of integrated circuit chips offers a variety of advantages and can be applied in several scenarios. Some of the advantages and application scenarios are mentioned below:Advantages: 1. Wide compatibility: These chips are designed to be compatible with a wide range of input and output voltage levels, making them suitable for various applications. 2. Bi-directional level shifting: They provide bidirectional voltage level shifting from 1.2V to 3.3V or 5V, allowing seamless communication between devices operating at different voltage levels. 3. Low power consumption: The chips consume low power, making them energy-efficient and suitable for portable devices or applications with power constraints. 4. Fast data propagation: They offer high-speed data transmission capabilities, ensuring efficient communication between devices. 5. ESD protection: These chips come with built-in Electrostatic Discharge (ESD) protection, safeguarding the connected devices from potential damage caused by electrostatic discharge.Application Scenarios: 1. Interface conversion: The PI3B32x245BEx chips can be used in scenarios where voltage level conversion is required between different interfaces, such as I2C, SPI, or UART. They enable communication between devices operating at different voltage levels. 2. Mixed voltage systems: These chips are suitable for systems that involve mixed voltage levels, such as voltage translation in battery-powered applications or connecting sensors with different voltage requirements. 3. Signal muxing/demuxing: The chips can be used to multiplex or demultiplex signals from multiple sources, allowing efficient routing and selection of signals. 4. Bi-directional level shifting: They are useful in scenarios where signals need to be translated bidirectionally, ensuring seamless communication between devices operating at different voltage levels. 5. Board-level protection: These chips can be utilized to provide ESD protection at the board level, preventing damage to sensitive components during handling, assembly, or operation.These advantages and application scenarios demonstrate the versatility and usefulness of the PI3B32x245BEx integrated circuit chips in various digital systems and communication applications.
SY10EL16VAKG-TR Relevant information