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SSTVA16859CGLFT

SSTVA16859CGLFT

Manufacturer No:

SSTVA16859CGLFT

Description:

IC BUFFER DDR 13-26BIT 64-TSSOP

Datasheet:

Datasheet

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SSTVA16859CGLFT Specifications

  • Type
    Parameter
  • Supplier Device Package
    64-TSSOP
  • Package / Case
    64-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Number of Bits
    13, 26
  • Supply Voltage
    2.3V ~ 2.7V
  • Logic Type
    Registered Buffer with SSTL_2 Compatible I/O for DDR
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The BCM56150A0IFSBG is a specific model of integrated circuit chip developed by Broadcom. It is a high-performance Ethernet switch chip designed for use in various networking applications. Some of the advantages and application scenarios of this chip are:1. High Performance: The BCM56150A0IFSBG chip offers high-performance switching capabilities, enabling fast and efficient data transfer rates. It supports up to 48 Gigabit Ethernet ports, making it suitable for high-bandwidth applications.2. Power Efficiency: This chip incorporates advanced power-saving features, allowing for efficient power consumption. It helps in reducing energy costs and minimizing the environmental impact of networking devices.3. Scalability: The BCM56150A0IFSBG chip is designed to support scalable network architectures. It can be used in various network setups, including small to medium-sized businesses, data centers, and enterprise networks.4. Advanced Features: The chip provides advanced features such as Quality of Service (QoS) support, VLAN tagging, and security features like Access Control Lists (ACLs). These features enhance network performance, security, and manageability.5. Network Virtualization: The BCM56150A0IFSBG chip supports network virtualization technologies like Virtual Local Area Networks (VLANs) and Virtual Router Redundancy Protocol (VRRP). It enables the creation of virtual networks, improving network efficiency and flexibility.6. Data Center Applications: Due to its high-performance capabilities, the chip is suitable for data center applications. It can be used in top-of-rack switches, leaf switches, and spine switches, providing high-speed connectivity and efficient data handling.7. Enterprise Networking: The chip is also applicable in enterprise networking scenarios, where it can be used in switches for office networks, campus networks, and branch offices. It offers reliable and high-speed connectivity for various devices and users.8. Service Provider Networks: The BCM56150A0IFSBG chip can be utilized in service provider networks, including carrier Ethernet switches and aggregation switches. It enables efficient data transfer and supports advanced features required in service provider environments.Overall, the BCM56150A0IFSBG integrated circuit chip offers high performance, power efficiency, and advanced features, making it suitable for a wide range of networking applications in different industries.
SSTVA16859CGLFT Relevant information