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SSTV16859CKLF

SSTV16859CKLF

Manufacturer No:

SSTV16859CKLF

Description:

IC BUS DVR UNIV 13-26BIT 56VFQFN

Datasheet:

Datasheet

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SSTV16859CKLF Specifications

  • Type
    Parameter
  • Supplier Device Package
    56-VFQFPN (8x8)
  • Package / Case
    56-VFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Number of Bits
    13, 26
  • Supply Voltage
    2.3V ~ 2.7V
  • Logic Type
    Registered Buffer with SSTL_2 Compatible I/O for DDR
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    74SSTV
The BCM56143A0KFEBG integrated circuit chips, manufactured by Broadcom, offer several advantages and application scenarios, including:1. High-speed Networking: The chips are designed specifically for Ethernet networking applications, providing high-performance connectivity solutions for enterprise networks, data centers, and service provider networks.2. Energy Efficiency: These chips feature advanced power management technologies, allowing for energy-efficient networking solutions. This is beneficial for organizations looking to reduce power consumption and operating costs.3. Scalability: The chips support various port configurations, enabling scalability and flexibility in network designs. They can be used in switches and routers with different port densities, ranging from small-scale implementations to large-scale data centers.4. Reliability: The BCM56143A0KFEBG chips offer robust and reliable network connectivity, ensuring minimal downtime and reliable data transmission. This is crucial in mission-critical applications where network reliability is of utmost importance.5. QoS and Security: These chips support Quality of Service (QoS) features, enabling prioritization of network traffic based on specific requirements. Additionally, they incorporate security mechanisms like IEEE 802.1X authentication and Access Control Lists (ACLs) to enhance network security.Application scenarios for BCM56143A0KFEBG chips can include:1. Enterprise Networking: These chips can be used in enterprise switches to provide high-speed and reliable connectivity for businesses. They support features like VLANs, link aggregation, and QoS to ensure optimal performance and security.2. Data Centers: The chips are suitable for use in data center switches and routers, offering high port densities, low-latency connectivity, and energy efficiency. They facilitate the handling of large amounts of network traffic in dense and demanding data center environments.3. Service Provider Networks: The chips can be utilized in routers and switches deployed by service providers to deliver high-speed internet connectivity to customers. Their scalability and reliability make them ideal for such applications.4. Network Infrastructure Upgrades: The chips can be used to upgrade existing network infrastructures by replacing legacy networking equipment. Their high-performance capabilities and compatibility with various network protocols make them suitable for infrastructure modernization projects.Overall, the BCM56143A0KFEBG integrated circuit chips provide advanced networking capabilities, energy efficiency, scalability, and reliability. Their application scenarios range from enterprise networks to data centers and service provider networks, enabling organizations to build high-performing and cost-effective networking solutions.
SSTV16859CKLF Relevant information