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SSTUF32864BHLFT

SSTUF32864BHLFT

Manufacturer No:

SSTUF32864BHLFT

Description:

IC REGIST BUFF 25BIT DDR2 96-BGA

Datasheet:

Datasheet

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SSTUF32864BHLFT Specifications

  • Type
    Parameter
  • Supplier Device Package
    96-CABGA (13.5x5.5)
  • Package / Case
    96-LFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Number of Bits
    25, 14
  • Supply Voltage
    1.7V ~ 1.9V
  • Logic Type
    Configurable Registered Buffer for DDR2
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The PI3B34X245BEX integrated circuit chips offer several advantages and can be used in various application scenarios. Some of the advantages and typical usage scenarios are:1. High-speed data transmission: The PI3B34X245BEX chips support high-speed data transmission up to 400 Mbps. This makes them suitable for applications involving fast digital data transfer.2. Bi-directional level shifting: These chips facilitate bi-directional level shifting between different voltage domains. They provide an easy interface between circuits operating at different voltages, allowing communication between them.3. Wide voltage range: The chips can operate with a wide range of input and output voltages, typically from 1.65V to 5.5V. This flexibility in voltage levels enables compatibility with various devices and systems.4. Low power consumption: The PI3B34X245BEX chips consume low power, making them energy-efficient. This is particularly advantageous for portable devices that rely on battery power or applications requiring efficient power management.5. ESD protection: The chips are designed with built-in electrostatic discharge (ESD) protection, safeguarding the circuit from damage caused by electrostatic discharges. This protection enhances the reliability and durability of the integrated circuits.6. Space-saving package: These chips are available in compact package options, such as a small thin quad flat no-lead (TQFN) package. This compact form factor saves space on the printed circuit board (PCB) and is suitable for applications with size constraints.Typical application scenarios for PI3B34X245BEX chips include:1. Communication systems: The chips can be used in communication systems to interface and convert signals between different voltage levels, facilitating data exchange between components operating at different voltages.2. Portable devices: Due to their low power consumption and small package size, these chips are suitable for use in portable devices like smartphones, tablets, and wearable devices. They enable efficient data transmission while minimizing power drain and board space utilization.3. Industrial automation: In industrial automation systems, these chips can be employed to ensure compatibility between various modules or subsystems that operate at different voltage ranges, enabling seamless communication and control.4. Consumer electronics: PI3B34X245BEX chips find applications in various consumer electronics devices, including gaming consoles, set-top boxes, printers, and audio/video equipment. They can be used for voltage level shifting and data transmission between different components.It's important to note that the specific application scenarios may vary depending on the needs of the design and the compatibility with other components within the system.
SSTUF32864BHLFT Relevant information