SSTUB32871AHMLF
Manufacturer No:
SSTUB32871AHMLF
Manufacturer:
Description:
IC REGIST BUFF 27BIT DDR2 96-BGA
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SSTUB32871AHMLF Specifications
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TypeParameter
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Supplier Device Package96-CABGA (13.5x5.5)
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Package / Case96-LFBGA
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Mounting TypeSurface Mount
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Operating Temperature0°C ~ 70°C
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Number of Bits27
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Supply Voltage1.7V ~ 1.9V
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Logic TypeRegistered Buffer for DDR2
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PackagingTray
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Product StatusObsolete
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Series-
The 74CB3T3383DBQRG4 is an integrated circuit chip belonging to the 74CB3T series of bus switch devices. Here are some advantages and application scenarios of this chip:Advantages: 1. Low power consumption: The 74CB3T3383DBQRG4 chip operates at a lower power supply range of 1.65V to 5.5V, making it suitable for energy-efficient applications. 2. Wide voltage range: It has a wide voltage range tolerance that allows compatibility with various power supply levels. 3. High-speed switching: This chip provides fast switching speeds, enabling efficient data transmission and communication. 4. Low ON-state resistance: It offers low ON-state resistance, minimizing signal distortion and ensuring reliable data transfer. 5. SMD packaging: The 74CB3T3383DBQRG4 is available in a small-outline IC (SOIC) package, which makes it easily mountable on printed circuit boards (PCBs).Application Scenarios: 1. Level shifting: The 74CB3T3383DBQRG4 is commonly used in level shifting applications where it interfaces between different voltage domains. 2. I/O expansion: This chip can be utilized for expanding the I/O capabilities of microcontrollers or other integrated circuits, providing additional input/output channels. 3. Bus switching: It is frequently employed for bidirectional switching between different buses or data lines within a system. 4. Battery-powered devices: Due to its low power consumption, the 74CB3T3383DBQRG4 is well-suited for portable and battery-operated devices, such as smartphones, tablets, and wearable gadgets. 5. Communication systems: This chip can be used in various communication systems, including data switches, routers, hubs, and network devices.Note: It is always recommended to consult the datasheet and technical documentation of the specific chip for a comprehensive understanding of its features, specifications, and operating conditions.
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