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SN74S1050D

SN74S1050D

Manufacturer No:

SN74S1050D

Manufacturer:

Texas Instruments

Description:

IC12-BIT BUS TERM ARRAY 16-SOIC

Datasheet:

Datasheet

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SN74S1050D Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SOIC
  • Package / Case
    16-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Number of Bits
    12
  • Supply Voltage
    -
  • Logic Type
    Schottky Barrier Diode Bus-Termination Array
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    74S
The BCM56750A2IFSBG is a type of integrated circuit (IC) chip developed by Broadcom. It is primarily used in networking equipment and offers several advantages and application scenarios. Some of these advantages and scenarios include:1. High Performance: The BCM56750A2IFSBG chip is capable of delivering high-performance networking capabilities. It can handle large amounts of data traffic and has advanced processing capabilities, making it ideal for use in high-end networking devices.2. Low Latency: Networking equipment powered by the BCM56750A2IFSBG chip can achieve low latency, ensuring fast and efficient data transmission. This can be crucial in scenarios where real-time data processing and rapid response times are required.3. Energy Efficiency: The BCM56750A2IFSBG chip is designed with power efficiency in mind. It incorporates power-saving features, allowing devices built with this chip to consume less energy. This makes it suitable for applications where energy efficiency is a priority.4. Network Switching: The chip is commonly used in network switches, enabling efficient packet forwarding and routing. It supports various network protocols and offers features like Quality of Service (QoS) and VLAN (Virtual Local Area Network) support, enhancing network performance and management.5. Data Centers: The BCM56750A2IFSBG chip finds application in data center networking equipment. Its high performance, low latency, and energy efficiency make it well-suited for handling the immense data traffic experienced in modern data centers.6. Telecommunications: The chip can be used in telecommunications infrastructure, including routers and switches. Its capabilities allow for efficient and reliable data transmission, making it suitable for telecommunications networks that require high-speed connectivity.7. High-Speed Internet: The BCM56750A2IFSBG chip is often deployed in networking devices for high-speed internet connections, such as fiber-optic networks. Its advanced processing power and low latency ensure efficient data handling to deliver fast internet connectivity.Overall, the BCM56750A2IFSBG chip offers high performance, low latency, energy efficiency, and versatility, making it suitable for various networking applications, including network switches, data centers, telecommunications, and high-speed internet connections.
SN74S1050D Relevant information