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MC100EP16TDR2

MC100EP16TDR2

Manufacturer No:

MC100EP16TDR2

Manufacturer:

onsemi

Description:

IC RCVR/DRVR 5V DIFF ECL 8-SOIC

Datasheet:

Datasheet

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MC100EP16TDR2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Number of Bits
    1
  • Supply Voltage
    3V ~ 5.5V
  • Logic Type
    Differential Receiver/Driver
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    100EP
The BCM56846A1IFTBG integrated circuit chip is a high-performance Ethernet switch chip developed by Broadcom. Here are some of its advantages and application scenarios:Advantages: 1. High-Speed Connectivity: The chip supports high-speed connectivity with up to 48 Gigabit Ethernet ports and 4 10-Gigabit Ethernet ports, making it suitable for high-bandwidth applications. 2. Robust Performance: It offers advanced features like cut-through switching, virtual LANs (VLANs), and Quality of Service (QoS) capabilities, ensuring reliable and optimized network performance. 3. Power Efficiency: The chip is designed with power-saving features that enhance energy efficiency while maintaining network performance, contributing to reduced power consumption. 4. Scalability: It allows for flexible network expansion and growth due to its ability to support multiple ports and features. 5. Security: The chip incorporates advanced security features such as Access Control Lists (ACLs), authentication, and encryption, adding an extra layer of protection to the network.Application Scenarios: 1. Data Centers: The BCM56846A1IFTBG chip is often used in large-scale data centers where high port density and fast connectivity are required to handle massive amounts of data traffic efficiently. 2. Enterprise Networks: It is suitable for enterprise networks that demand robust and secure switching capabilities, offering high-performance connectivity for applications like video streaming, cloud computing, and data transmission within the organization. 3. Service Providers: The chip can be used in service provider networks to deliver reliable and high-speed Ethernet connectivity to customers, ensuring smooth communication and data transfer. 4. Campus Networks: It is commonly used in educational institutions or corporate campuses that require a scalable and secure network infrastructure to connect a large number of devices and users. 5. Telecommunications: Telecom providers can utilize the chip for building advanced network switches that offer high-speed connectivity and advanced features like QoS and security for handling voice, video, and data services effectively.Overall, the BCM56846A1IFTBG integrated circuit chip provides high-performance switching capabilities, scalability, and advanced features, making it suitable for various demanding networking applications.
MC100EP16TDR2 Relevant information