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MC100EP16FDR2G

MC100EP16FDR2G

Manufacturer No:

MC100EP16FDR2G

Manufacturer:

onsemi

Description:

IC RCVR/DRVR 5V DIFF ECL 8-SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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MC100EP16FDR2G Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Number of Bits
    -
  • Supply Voltage
    3V ~ 5.5V
  • Logic Type
    Differential Receiver/Driver
  • Packaging
    Bulk
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    100EP
The BCM56841B1KFRBG is a specific variant of the Broadcom BCM56840 series of integrated circuit chips, designed for use in networking applications. Here are some advantages and application scenarios for this chip:Advantages: 1. High port density: The BCM56841B1KFRBG offers high port density, supporting up to 64 ports of 100 Gigabit Ethernet (GbE) or 256 ports of 25 GbE. This makes it suitable for high-performance data centers and enterprise networks requiring large-scale connectivity.2. Scalability: The chip provides flexible scalability options, allowing network administrators to increase the number of ports as their network requirements grow. This makes it a future-proof solution for evolving network infrastructures.3. Advanced features: The BCM56841B1KFRBG includes advanced features such as advanced traffic management, deep packet buffering, and advanced Quality of Service (QoS) capabilities. These features enable efficient handling of network traffic, prioritization of critical applications, and optimal utilization of network resources.4. Low latency: The chip provides low-latency switching, ensuring minimal delays in data transmission. This is crucial for real-time applications such as high-frequency trading, streaming, and video conferencing, where low latency is essential.Application Scenarios: 1. Data centers: The BCM56841B1KFRBG chip is widely used in data center networking due to its high port density, scalability, and advanced features. It enables data centers to handle massive amounts of network traffic and support high-speed connectivity for servers, storage systems, and other network elements.2. Cloud service providers: Cloud service providers often require highly scalable and high-performance networking solutions to cater to the demands of their customers. The BCM56841B1KFRBG chip enables them to build robust and efficient networks that deliver high-speed connectivity to their cloud infrastructure.3. Enterprise networks: Large enterprises with complex networks can benefit from the high port density and scalability offered by the BCM56841B1KFRBG chip. It allows them to connect a large number of devices, servers, and switches in their network infrastructure, ensuring seamless communication and efficient resource utilization.4. Internet service providers (ISPs): ISPs can leverage the BCM56841B1KFRBG chip to build high-bandwidth backbone networks or interconnect multiple data centers. The advanced features and low latency of the chip facilitate the delivery of reliable and high-performance network services to their customers.Overall, the BCM56841B1KFRBG chip is well-suited for scalable and high-performance networking applications, especially in data centers, cloud environments, large enterprises, and ISPs.
MC100EP16FDR2G Relevant information