SY10EP16VZI

SY10EP16VZI

Manufacturer No:

SY10EP16VZI

Manufacturer:

Microchip Technology

Description:

IC RCVR HS DIFF 5V/3.3V 8-SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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SY10EP16VZI Specifications

  • Type
    Parameter
  • Supplier Device Package
    8-SOIC
  • Package / Case
    8-SOIC (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Number of Bits
    1
  • Supply Voltage
    3V ~ 5.5V
  • Logic Type
    Differential Receiver/Driver
  • Packaging
    Bulk
  • Product Status
    Discontinued at Digi-Key
  • Series
    10EP
The BCM56842A1IFTBG is a high-performance integrated circuit chip developed by Broadcom. It is specifically designed for Ethernet switching applications and offers several advantages and application scenarios:1. High Performance: The BCM56842A1IFTBG chip provides high-speed Ethernet switching capabilities, supporting up to 64 ports of 10 Gigabit Ethernet (GbE) or 16 ports of 40 GbE. It offers low-latency and high-bandwidth switching, making it suitable for demanding networking environments.2. Scalability: This chip is highly scalable, allowing for flexible configurations and expansion options. It supports various port speeds and can be used in different network architectures, including data centers, enterprise networks, and service provider networks.3. Advanced Features: The BCM56842A1IFTBG chip incorporates advanced features such as virtual LAN (VLAN) support, Quality of Service (QoS) capabilities, and security features like Access Control Lists (ACLs). These features enable efficient traffic management, network segmentation, and enhanced security.4. Power Efficiency: Broadcom's chip is designed to be power-efficient, helping to reduce energy consumption and operational costs. It incorporates power-saving technologies like Energy Efficient Ethernet (EEE) and supports advanced power management features.5. Application Scenarios: The BCM56842A1IFTBG chip finds applications in various networking scenarios, including: a. Data Centers: It can be used in high-density server environments, providing high-speed connectivity and efficient traffic management for virtualized applications and cloud computing. b. Enterprise Networks: The chip enables high-performance switching in large-scale enterprise networks, supporting multiple VLANs, QoS, and security features. c. Service Provider Networks: It can be utilized in carrier-grade networks, offering high-speed aggregation and distribution capabilities for delivering services to end-users. d. Campus Networks: The chip can be deployed in educational institutions or corporate campuses, providing high-bandwidth connectivity and efficient network management.In summary, the BCM56842A1IFTBG integrated circuit chip offers high-performance Ethernet switching capabilities, scalability, advanced features, power efficiency, and finds applications in various networking scenarios.