CY2SSTV16859ZC
Manufacturer No:
CY2SSTV16859ZC
Manufacturer:
Description:
IC BUF NON-INVERT 2.7V 64TSSOP
Datasheet:
Delivery:
Payment:
In Stock : 3751
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CY2SSTV16859ZC Specifications
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TypeParameter
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Supplier Device Package64-TSSOP
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Package / Case64-TFSOP (0.240", 6.10mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C (TA)
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Number of Bits-
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Supply Voltage-
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Logic Type-
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PackagingBulk
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Product StatusActive
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Series-
The MB90022PF-GS-431 is a specific model of an integrated circuit chip, and its advantages and application scenarios can vary depending on the specific features and capabilities of the chip. Unfortunately, without more information about the chip, it is not possible to provide specific advantages and application scenarios for the MB90022PF-GS-431.However, in general, integrated circuit chips are used in a wide range of electronic devices and applications. Some common advantages and application scenarios of integrated circuit chips include:1. Miniaturization: Integrated circuit chips allow for the miniaturization of electronic devices, making them smaller and more portable.2. Increased functionality: Integrated circuit chips can integrate multiple functions and components into a single chip, reducing the need for separate components and improving overall functionality.3. Power efficiency: Integrated circuit chips can be designed to be power-efficient, helping to extend battery life in portable devices.4. Cost-effectiveness: Mass production of integrated circuit chips can lead to cost savings, making them a cost-effective solution for various applications.5. Versatility: Integrated circuit chips can be used in a wide range of applications, including consumer electronics, automotive systems, industrial automation, telecommunications, and more.It is important to consult the datasheet or technical documentation of the specific MB90022PF-GS-431 chip to understand its unique features, advantages, and recommended application scenarios.
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