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74AUP1Z04GF132

74AUP1Z04GF132

Manufacturer No:

74AUP1Z04GF132

Manufacturer:

NXP USA Inc.

Description:

NOW NEXPERIA 74AUP1Z04GF - BUS D

Datasheet:

Datasheet

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74AUP1Z04GF132 Specifications

  • Type
    Parameter
  • Supplier Device Package
    6-XSON (1x1)
  • Package / Case
    6-XFDFN
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Number of Bits
    -
  • Supply Voltage
    0.8V ~ 3.6V
  • Logic Type
    Inverter, X-Tal Driver
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    74AUP
CBT3126DS and 112 are not widely recognized or standardized codes for integrated circuit chips. It seems they do not represent a specific chip or family of chips with well-documented advantages or application scenarios. In such cases, it is difficult to provide accurate information without additional context or specifications.However, in general, integrated circuit chips offer several advantages:1. Miniaturization: Integrated circuits pack a large number of electronic components into a small chip, enabling compact electronic designs.2. Power Efficiency: Integrated circuits are designed to consume minimal power, making them suitable for battery-operated devices and energy-efficient applications.3. Reliability: Integrated circuits are less prone to failures, as they have fewer external connections and internal components are protected within the chip package.4. Cost-Effectiveness: Mass production of integrated circuits reduces costs, making them economical for various applications.Regarding application scenarios, integrated circuit chips find use in countless electronic devices and systems, including:1. Consumer Electronics: Smartphones, tablets, televisions, gaming consoles, digital cameras, etc.2. Automotive Electronics: Engine control units, infotainment systems, sensors, etc.3. Industrial Automation: Programmable logic controllers (PLCs), motor drives, robotics, etc.4. Medical Devices: Implantable medical devices, diagnostic equipment, monitoring systems, etc.5. Internet of Things (IoT): IoT devices, wearable technology, home automation, etc.6. Aerospace and Defense: Avionics, satellite systems, radar systems, etc.These are just a few examples, and the scope of integrated circuit applications is vast and continually expanding. If there is more specific information available or a different code provided, it would be easier to provide detailed advantages and application scenarios for a particular integrated circuit chip.
74AUP1Z04GF132 Relevant information