PI5C33X257BEX

PI5C33X257BEX

Manufacturer No:

PI5C33X257BEX

Manufacturer:

Diodes Incorporated

Description:

IC MUX/DEMUX 1 X 8:4 48BQSOP

Datasheet:

Datasheet

Delivery:

Payment:

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PI5C33X257BEX Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-BQSOP
  • Package / Case
    48-FSOP (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    4.75V ~ 5.25V
  • Voltage Supply Source
    Single Supply
  • Current - Output High, Low
    -
  • Independent Circuits
    3
  • Circuit
    1 x 8:4
  • Type
    Multiplexer/Demultiplexer
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The SN74FB1651PCA is a specific model of integrated circuit chip manufactured by Texas Instruments. It is a 16-bit universal bus transceiver with 3-state outputs. Here are some advantages and application scenarios of this chip:Advantages: 1. High-speed data transfer: The SN74FB1651PCA supports high-speed data transfer rates, making it suitable for applications that require fast communication between different components. 2. Bidirectional data flow: It allows bidirectional data flow, enabling data transmission in both directions on the bus. 3. 3-state outputs: The chip has 3-state outputs, which means it can be disabled or put into a high-impedance state when not actively transmitting data. This feature allows multiple devices to share the same bus without interfering with each other. 4. Wide operating voltage range: The chip can operate within a wide voltage range, making it compatible with various power supply configurations.Application scenarios: 1. Data communication systems: The SN74FB1651PCA can be used in various data communication systems, such as computer buses, networking equipment, and industrial automation, where high-speed data transfer and bidirectional communication are required. 2. Memory interfacing: It can be used to interface with memory devices, such as RAM or ROM, allowing data to be read from or written to these memory modules. 3. Input/output expansion: The chip can be used to expand the number of input/output ports in microcontrollers or other digital systems, enabling communication with a larger number of external devices. 4. Bus sharing: The 3-state outputs of the chip make it suitable for bus sharing scenarios, where multiple devices need to share the same bus without interfering with each other. This can be useful in systems with multiple peripherals or in multi-master bus architectures.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and design of the overall system.