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MC14066BFELG

MC14066BFELG

Manufacturer No:

MC14066BFELG

Manufacturer:

onsemi

Description:

IC BILATERAL SW 1 X 1:1 14SOEIAJ

Datasheet:

Datasheet

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MC14066BFELG Specifications

  • Type
    Parameter
  • Supplier Device Package
    SOEIAJ-14
  • Package / Case
    14-SOIC (0.209", 5.30mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C
  • Voltage - Supply
    3V ~ 18V
  • Voltage Supply Source
    Dual Supply
  • Current - Output High, Low
    -
  • Independent Circuits
    4
  • Circuit
    1 x 1:1
  • Type
    Bilateral, FET Switches
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    4000B
The 74SSTUBF32866BBFG is an advanced integrated circuit chip that offers several advantages and can be applied to various scenarios. Some of its advantages and application scenarios include:1. High-Speed Operation: The chip is designed for high-speed operation, making it ideal for use in applications that require fast data transfer and processing. This includes networking equipment, high-performance computing systems, and communication devices.2. Low Power Consumption: The chip is designed to minimize power consumption, making it suitable for battery-powered devices and energy-efficient systems. It is commonly used in portable electronics, such as smartphones, tablets, and wearable devices.3. Large Memory Capacity: The chip has a large memory capacity, typically featuring multiple banks of memory cells. This makes it suitable for applications that require significant storage capabilities, such as data centers, servers, and storage devices.4. Error Correction: The chip incorporates error correction features, ensuring accurate and reliable data transmission. This is particularly useful in communication systems, memory modules, and data-intensive applications where data integrity is crucial.5. Signal Integrity: The chip is designed to maintain signal integrity even at high data rates, ensuring reliable and consistent performance. It is often used in high-frequency systems, signal processing applications, and telecommunications equipment.6. Ruggedness and Durability: The chip is engineered to withstand harsh operating conditions, including temperature variations and electrical noise. This makes it suitable for automotive electronics, industrial automation, and outdoor applications.7. Scalability: The chip offers scalability, allowing it to be used in various configurations and system designs. This flexibility makes it suitable for a wide range of applications, from small consumer devices to large-scale enterprise systems.Overall, the 74SSTUBF32866BBFG integrated circuit chip offers high performance, low power consumption, and reliability, making it suitable for a broad range of application scenarios in multiple industries.
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