7SB3125AMX1TCG

7SB3125AMX1TCG

Manufacturer No:

7SB3125AMX1TCG

Manufacturer:

onsemi

Description:

IC BUS SWITCH 1 X 1:1 6ULLGA

Datasheet:

Datasheet

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7SB3125AMX1TCG Specifications

  • Type
    Parameter
  • Supplier Device Package
    6-ULLGA (1.45x1)
  • Package / Case
    6-XFLGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C
  • Voltage - Supply
    4V ~ 5.5V
  • Voltage Supply Source
    Single Supply
  • Current - Output High, Low
    -
  • Independent Circuits
    1
  • Circuit
    1 x 1:1
  • Type
    Bus Switch
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    -
The MC10LVEP16DR2G is a high-speed differential receiver integrated circuit chip. It is part of the ECLinPS MAX family of devices offered by ON Semiconductor. Here are some advantages and application scenarios of this chip:Advantages: 1. High-speed operation: The MC10LVEP16DR2G is designed to operate at very high speeds, making it suitable for applications that require fast data transmission and processing. 2. Low power consumption: This chip is designed to consume low power, making it suitable for battery-powered devices or applications where power efficiency is crucial. 3. Differential signaling: The chip uses differential signaling, which provides better noise immunity and signal integrity compared to single-ended signaling. 4. Wide operating voltage range: The chip can operate over a wide voltage range, typically from -4.2V to -5.7V, allowing flexibility in different power supply configurations.Application scenarios: 1. High-speed data communication: The MC10LVEP16DR2G can be used in applications that require high-speed data transmission, such as fiber optic communication systems, high-speed networking equipment, or high-speed data links. 2. Clock and data distribution: The chip can be used in clock and data distribution systems, where it receives high-speed clock or data signals and distributes them to multiple destinations while maintaining signal integrity. 3. Test and measurement equipment: The chip can be used in test and measurement equipment that requires high-speed signal acquisition and processing, such as oscilloscopes, logic analyzers, or high-speed data acquisition systems. 4. Industrial automation: The chip can be used in industrial automation systems that require high-speed data processing, such as motion control systems, robotics, or high-speed data acquisition in manufacturing processes.It is important to note that the specific application scenarios may vary depending on the requirements and specifications of the overall system design.