IDT72V70810TF

IDT72V70810TF

Manufacturer No:

IDT72V70810TF

Description:

IC MULTIPLEXER 1 X 8:8 64TQFP

Datasheet:

Datasheet

Delivery:

Payment:

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IDT72V70810TF Specifications

  • Type
    Parameter
  • Supplier Device Package
    64-TQFP (10x10)
  • Package / Case
    64-LQFP
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3V ~ 3.6V
  • Voltage Supply Source
    Single Supply
  • Current - Output High, Low
    -
  • Independent Circuits
    1
  • Circuit
    1 x 8:8
  • Type
    Multiplexer
  • Packaging
    Tray
  • Product Status
    Obsolete
  • Series
    72V
The 74ACT11139PWR is a specific integrated circuit (IC) chip, and as an AI language model, I don't have access to real-time information on specific products released after my last training data in March 2023. Therefore, I cannot provide you with the specific advantages and application scenarios of the 74ACT11139PWR chip.However, in general, IC chips like the 74ACT11139PWR are designed for specific purposes and have various advantages and application scenarios. Some common advantages of IC chips include:1. Miniaturization: IC chips are compact and can integrate multiple electronic components onto a single chip, reducing the size and complexity of electronic devices.2. Power efficiency: IC chips are designed to operate with low power consumption, making them suitable for battery-powered devices.3. Reliability: IC chips are manufactured using advanced processes, resulting in improved reliability and performance compared to discrete components.4. Cost-effectiveness: Mass production of IC chips reduces manufacturing costs, making them more affordable compared to individual components.As for application scenarios, IC chips are used in a wide range of electronic devices, including computers, smartphones, televisions, automotive systems, medical equipment, and more. The specific application scenarios of the 74ACT11139PWR chip would depend on its features, specifications, and intended use, which can be found in the chip's datasheet or product documentation provided by the manufacturer.