SN74145NSRE4

SN74145NSRE4

Manufacturer No:

SN74145NSRE4

Manufacturer:

Texas Instruments

Description:

IC DECODER 1 X 4:10 16SO

Datasheet:

Datasheet

Delivery:

Payment:

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SN74145NSRE4 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SO
  • Package / Case
    16-SOIC (0.209", 5.30mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Voltage - Supply
    4.75V ~ 5.25V
  • Voltage Supply Source
    Single Supply
  • Current - Output High, Low
    -, 80mA
  • Independent Circuits
    1
  • Circuit
    1 x 4:10
  • Type
    Decoder
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    7400
The BCM56850XA2KFSBG is an integrated circuit (IC) chip developed by Broadcom. It is a high-performance switch fabric device designed for data center and enterprise applications. Here are some advantages and application scenarios of this chip:1. High port density: The BCM56850XA2KFSBG chip offers a high port density, with up to 128 ports on a single chip. This makes it suitable for use in large-scale network deployments where a high number of ports are required.2. High bandwidth and throughput: With a fabric capacity of up to 2.56 Tbps, the chip provides high bandwidth and throughput capabilities. It enables efficient data transfer rates, ensuring smooth communication within the network.3. Versatile support for protocols: The chip supports various protocols, including Ethernet, Fibre Channel, and InfiniBand. It allows for the seamless integration of different types of network devices and ensures interoperability.4. Advanced features and functionalities: The BCM56850XA2KFSBG chip incorporates advanced features like Quality of Service (QoS), Virtual LAN (VLAN) support, and security features such as Access Control Lists (ACLs) and Encryption. These features enhance the performance, security, and manageability of the network.5. Energy-efficient design: Broadcom emphasizes energy efficiency in its chip designs. The BCM56850XA2KFSBG chip incorporates power-saving technologies, enabling reduced power consumption and contributing to a greener and more sustainable network infrastructure.Application scenarios:1. Data centers: The high port density, bandwidth, and advanced features of the BCM56850XA2KFSBG make it suitable for use in large data centers. It can serve as a switch fabric in data center networks, facilitating efficient and reliable data transfer between servers, storage systems, and other devices.2. Enterprise networks: The chip can be used in enterprise networks where high-performance networking is required. It can be used in switches and routers to provide fast and reliable connectivity for critical applications and services.3. Service providers: The BCM56850XA2KFSBG chip can be deployed in service provider networks to handle high volumes of network traffic. It enables service providers to offer high-speed internet connectivity, IPTV, VoIP, and other services to their customers.4. Cloud computing: Given its high bandwidth and throughput capabilities, the chip is well-suited for cloud computing environments. It can empower cloud service providers to deliver scalable and efficient cloud computing services.Overall, the BCM56850XA2KFSBG chip is designed for high-performance networking scenarios, where large-scale, reliable, and efficient data transfer is critical.