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SN74CB3T3383DW

SN74CB3T3383DW

Manufacturer No:

SN74CB3T3383DW

Manufacturer:

Texas Instruments

Description:

IC BUS FET EXCHG SW 5X2:2 24SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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SN74CB3T3383DW Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-SOIC
  • Package / Case
    24-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    2.3V ~ 3.6V
  • Voltage Supply Source
    Single Supply
  • Current - Output High, Low
    -
  • Independent Circuits
    1
  • Circuit
    5 x 2:2
  • Type
    Bus FET Exchange Switch
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    74CB
The MC10EP116FA integrated circuit chip offers several advantages and can be applied to various scenarios:1. High-speed performance: The chip operates at very high speeds, making it suitable for applications that require rapid data processing and communication.2. Low power consumption: The chip is designed to consume low power, making it suitable for battery-powered devices and energy-efficient applications.3. Differential inputs and outputs: The chip features differential inputs and outputs, which help improve noise immunity and signal integrity in high-speed data transmission.4. Flexibility in component cascading: The chip can be readily cascaded with other components, allowing for easy integration into larger systems.5. Wide temperature range: The chip is designed to operate across a wide temperature range, making it suitable for applications in varying environmental conditions.Some application scenarios for the MC10EP116FA chip include:1. Communication systems: The chip can be used in high-speed communication systems, such as fiber-optic networks, where rapid data transmission and signal integrity are crucial.2. Data processing: The high-speed performance of the chip makes it suitable for data-intensive applications like real-time data processing, image and video processing, and high-frequency trading.3. Industrial automation: The chip can be applied to industrial automation systems, such as high-speed control modules or data acquisition systems, where low power consumption and high-speed performance are essential.4. Test and measurement equipment: The chip can be used in instrumentation and test equipment to perform high-speed data acquisition, analysis, and signal generation.5. Aerospace and defense: The chip's wide temperature range and high-speed capabilities make it suitable for aerospace and defense applications, such as radar systems, avionics, and military communication systems.6. Medical devices: The chip can be utilized in medical devices that require high-speed data processing, such as image-guided surgery systems or real-time monitoring equipment.
SN74CB3T3383DW Relevant information