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MC74VHCT257ADTR2

MC74VHCT257ADTR2

Manufacturer No:

MC74VHCT257ADTR2

Manufacturer:

onsemi

Description:

IC MULTIPLEXER 4 X 2:1 16TSSOP

Datasheet:

Datasheet

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MC74VHCT257ADTR2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C
  • Voltage - Supply
    4.5V ~ 5.5V
  • Voltage Supply Source
    Single Supply
  • Current - Output High, Low
    8mA, 8mA
  • Independent Circuits
    1
  • Circuit
    4 x 2:1
  • Type
    Multiplexer
  • Packaging
    Bulk
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    74VHCT
The SN74SSTV32877GKER is a specific integrated circuit (IC) chip manufactured by Texas Instruments. While specific application scenarios may vary, the advantages and general applications include:1. High-Speed Data Transfer: The SN74SSTV32877GKER chip is designed for high-speed data transfer applications, supporting up to 3.75 Gbps per channel. It offers multiple channels, making it ideal for demanding data transfer scenarios.2. Flexible I/O Configuration: This IC chip provides configurable I/Os, allowing users to adapt to various interface requirements. It supports different protocols such as PCIe, SATA, Gigabit Ethernet, and more.3. Low Power Consumption: The SN74SSTV32877GKER chip is designed to minimize power consumption while maintaining high performance. It includes power management features and smart power-saving mechanisms, suitable for power-constrained applications.4. Signal Integrity and Equalization: The integrated circuits offer advanced signal integrity features such as adaptive equalization, pre-emphasis, and receive equalization. These features help compensate for signal degradation, reflections, and attenuation, enhancing overall signal quality at high data rates.5. Data Communication Systems: The primary application scenarios for the SN74SSTV32877GKER chip are communication systems that require high-speed data transfers, such as networking equipment, servers, storage devices, and other data-centric applications.6. Backplane Communication: This IC chip is commonly used in backplane communication systems, where multiple boards or modules exchange data across a shared physical connection. The high-speed capabilities and signal integrity features of the chip are well-suited for such applications.7. Data Centers and Cloud Computing: The SN74SSTV32877GKER chip finds relevance in data centers and cloud computing environments due to the need for fast and reliable data communication between servers, storage systems, and network devices.8. High-Performance Computing: In the context of high-performance computing (HPC), where data-intensive tasks are processed, this IC chip can be used to connect various components efficiently, ensuring high-speed data transfers between processors, accelerators, and memory subsystems.Overall, the SN74SSTV32877GKER integrated circuit chip offers high-speed data transfer capabilities, flexible I/O configuration, power efficiency, and signal integrity enhancements, making it suitable for applications involving data communication, networking, storage, and cloud computing.
MC74VHCT257ADTR2 Relevant information