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MC74LCX139DTR2 Specifications
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TypeParameter
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Supplier Device Package16-TSSOP
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Package / Case16-TSSOP (0.173", 4.40mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C
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Voltage - Supply2V ~ 3.6V
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Voltage Supply SourceSingle Supply
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Current - Output High, Low24mA, 24mA
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Independent Circuits2
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Circuit1 x 2:4
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TypeDecoder/Demultiplexer
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PackagingTape & Reel (TR)
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Product StatusObsolete
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Series74LCX
The IDT72V70810PF integrated circuit chip is a high-speed asynchronous FIFO memory primarily designed for data buffering and transmission in digital systems. Some advantages and application scenarios of this chip include:1. High-Speed Operation: The IDT72V70810PF chip operates at a high frequency, allowing for fast data transfer and processing. This makes it suitable for applications that require real-time and high-speed data buffering.2. Large Memory Capacity: This chip offers a large memory capacity of up to 64K x 16 bits, enabling the storage of a significant amount of data. It can handle large data streams efficiently, making it ideal for applications that involve massive data handling, such as high-speed communication systems.3. Asynchronous Operation: The chip supports asynchronous read and write operations, allowing data to be written and read at different rates. This makes it suitable for applications where the data source and destination operate at different speeds or have variable data rates.4. Programmable Almost-Full/Almost-Empty Flags: The chip features programmable almost-full and almost-empty flags that can be configured to trigger interrupt signals when the FIFO memory is nearly full or nearly empty. This enables efficient handling of buffer overflow or underflow conditions, making it useful in applications that require careful data flow management.5. Various Interface Options: The IDT72V70810PF chip offers multiple interface options, such as differential or single-ended clocks and data, as well as programmable input threshold levels. This flexibility allows the chip to be easily integrated into various system architectures and interfaced with different logic families.6. Application Scenarios: Some potential application scenarios for the IDT72V70810PF chip include networking equipment, telecommunications systems, data acquisition systems, video processing, digital signal processing, high-speed data logging, and various other data buffering and transmission applications.Overall, the IDT72V70810PF integrated circuit chip offers high-speed and large-capacity asynchronous FIFO memory, making it suitable for real-time data buffering and transmission applications.
MC74LCX139DTR2 Relevant information