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MC10H172FNR2 Specifications
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TypeParameter
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Supplier Device Package20-PLCC (9x9)
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Package / Case20-LCC (J-Lead)
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Mounting TypeSurface Mount
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Operating Temperature0°C ~ 75°C
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Voltage - Supply-4.94V ~ -5.46V
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Voltage Supply SourceDual Supply
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Current - Output High, Low-
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Independent Circuits1
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Circuit2 x 1:4
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TypeDecoder
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PackagingTape & Reel (TR)
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Product StatusObsolete
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Series10H
The SY56023RMG-TR is an integrated circuit chip with several advantages and application scenarios. Some of these advantages and application scenarios include:1. High-speed data transmission: The SY56023RMG-TR chip is designed for high-speed data transmission applications. It supports data rates of up to 1.25 Gbps, making it suitable for applications such as high-speed Ethernet, fiber-optic communication, and SONET/SDH networks.2. Low power consumption: The chip is designed with low power consumption characteristics. This makes it suitable for portable devices and battery-powered applications, where power efficiency is crucial.3. Compact size: The SY56023RMG-TR chip is available in a small form factor, allowing for compact and space-constrained designs. This makes it ideal for applications where board space is limited.4. High-performance equalization: The chip incorporates advanced equalization techniques that enable the compensation of signal distortion caused by long transmission lines or high-frequency content. This makes it suitable for applications where long-distance signal transmission is required, such as telecommunications and networking.5. Industry-standard compliance: The SY56023RMG-TR chip complies with industry-standard specifications such as IEEE 802.3 (Ethernet) and SONET/SDH standards. This ensures compatibility and interoperability with existing systems and networks.Application scenarios for the SY56023RMG-TR chip may include:1. Networking equipment: The chip can be used in routers, switches, and other networking equipment to enable high-speed data transmission and signal equalization.2. Optical communication: The chip is suitable for use in optical transceivers and fiber-optic communication systems, facilitating high-speed data transmission over long-distance optical fibers.3. High-speed data links: The SY56023RMG-TR chip can be used in applications requiring high-speed data links, such as video streaming, data centers, and high-performance computing.4. Wireless backhaul: The chip can be employed in wireless backhaul applications, enabling the transmission of high-speed data between base stations and core networks.5. Test and measurement equipment: The chip's high-speed data transmission capabilities and signal equalization make it suitable for use in test and measurement equipment, ensuring accurate and reliable data analysis and characterization.Overall, the SY56023RMG-TR chip's advantages and application scenarios make it well-suited for high-speed data transmission, signal equalization, and compatibility with various industry standards, enabling its use in a wide range of applications in telecommunications, networking, and data communication.
MC10H172FNR2 Relevant information