74LV139DB,112

74LV139DB,112

Manufacturer No:

74LV139DB,112

Manufacturer:

NXP USA Inc.

Description:

IC DECODER/DEMUX 1X2:4 16SSOP

Datasheet:

Datasheet

Delivery:

Payment:

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74LV139DB,112 Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-SSOP
  • Package / Case
    16-SSOP (0.209", 5.30mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply
    1V ~ 5.5V
  • Voltage Supply Source
    Single Supply
  • Current - Output High, Low
    12mA, 12mA
  • Independent Circuits
    2
  • Circuit
    1 x 2:4
  • Type
    Decoder/Demultiplexer
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    74LV
The MC100LVEP16MNR4G is a high-speed, low-voltage differential signaling (LVDS) integrated circuit chip. It offers several advantages and can be applied in various scenarios. Some of the advantages and application scenarios of the MC100LVEP16MNR4G are:Advantages: 1. High-speed operation: The chip supports data rates up to 3.2 Gbps, making it suitable for high-speed communication applications. 2. Low voltage differential signaling: LVDS technology provides low power consumption and noise immunity, making it ideal for high-speed data transmission over long distances. 3. Differential signaling: The chip uses differential signaling, which helps in reducing electromagnetic interference (EMI) and crosstalk. 4. Wide operating voltage range: The chip operates from a supply voltage range of -4.2V to -5.7V, allowing flexibility in different power supply configurations. 5. Small form factor: The chip comes in a compact package, making it suitable for space-constrained applications.Application Scenarios: 1. High-speed data communication: The MC100LVEP16MNR4G can be used in applications that require high-speed data transmission, such as telecommunications, networking, and data centers. 2. Clock distribution: The chip can be used for clock distribution in systems that require precise and synchronized timing signals, such as high-performance computing and test and measurement equipment. 3. SerDes (Serializer/Deserializer) applications: The chip can be used in SerDes applications to convert parallel data to serial data and vice versa, enabling high-speed data transfer between different components or systems. 4. Backplane communication: The chip can be used in backplane communication systems, where high-speed data needs to be transmitted over long distances with low power consumption and noise immunity. 5. Video transmission: The MC100LVEP16MNR4G can be used in video transmission applications, such as high-resolution displays, video surveillance systems, and digital signage, where high-speed and reliable data transmission is required.These are just a few examples of the advantages and application scenarios of the MC100LVEP16MNR4G integrated circuit chips. The specific use cases may vary depending on the requirements of the system or application.