74CBTLV16211CZRDR

74CBTLV16211CZRDR

Manufacturer No:

74CBTLV16211CZRDR

Manufacturer:

Texas Instruments

Description:

IC BUS SWITCH 12 X 1:1 54BGA

Datasheet:

Datasheet

Delivery:

Payment:

Please send RFQ , we will respond immediately.

74CBTLV16211CZRDR Specifications

  • Type
    Parameter
  • Supplier Device Package
    54-BGA Microstar Junior (8x5.5)
  • Package / Case
    54-TFBGA
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    2.3V ~ 3.6V
  • Voltage Supply Source
    Single Supply
  • Current - Output High, Low
    -
  • Independent Circuits
    2
  • Circuit
    12 x 1:1
  • Type
    Bus Switch
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    74CBTLV
The SSTUB32S868DHLF is an integrated circuit chip designed for low-power wireless communication applications using the Sub-1GHz frequency band. Here are some advantages and application scenarios for this chip:Advantages: 1. Low power consumption: The chip is optimized for low power operation, making it suitable for battery-powered devices and energy-efficient applications. 2. Sub-1GHz frequency band: Operating in this frequency range allows for better signal propagation through obstacles and longer transmission distances compared to higher frequency bands. 3. High data rate: The chip supports data rates up to 200kbps, enabling the transmission of sizable data packets within a reasonable time frame. 4. Excellent sensitivity: The receiver in the chip has high sensitivity, making it capable of receiving weak signals, which is important for long-range communications. 5. Integrated features: The chip incorporates various features like automatic acknowledgment, address filtering, and CRC error checking, simplifying the implementation of wireless communication protocols.Application Scenarios: 1. Internet of Things (IoT): The chip can be used in IoT applications that require long-range, low-power wireless communication, such as smart home systems, industrial monitoring, smart agriculture, and asset tracking. 2. Wireless Sensor Networks: It can be utilized in sensor networks for data collection and monitoring applications, including environmental monitoring, building automation, and smart metering. 3. Wireless Control Systems: The chip can enable wireless control and communication in applications like remote control devices, home automation systems, and industrial automation. 4. Energy Harvesting: Its low-power consumption makes it well-suited for energy harvesting applications, where the chip can be powered using harvested energy sources like solar or vibration energy. 5. Long-Range Communication: The chip's capability to transmit over long distances combined with its low power operation makes it suitable for applications that require long-range communication, such as rural broadband, smart grid, and remote monitoring.It's important to note that the specific application scenarios can vary based on the system architecture and requirements of the overall product design.