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PI3CH401LE

PI3CH401LE

Manufacturer No:

PI3CH401LE

Manufacturer:

Diodes Incorporated

Description:

IC BUS SWITCH 1 X 1:1 14TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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PI3CH401LE Specifications

  • Type
    Parameter
  • Supplier Device Package
    14-TSSOP
  • Package / Case
    14-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    2.25V ~ 3.6V
  • Voltage Supply Source
    Single Supply
  • Current - Output High, Low
    -
  • Independent Circuits
    4
  • Circuit
    1 x 1:1
  • Type
    Bus Switch
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The SY58030UMG-TR integrated circuit chip is a high-speed, low-power, and low-jitter driver and receiver chip designed for use in high-speed data communication applications. Some of its key advantages and application scenarios include:1. High-speed data transmission: The chip supports data rates up to 3.2 Gbps, making it suitable for high-speed communication protocols such as Gigabit Ethernet, Fibre Channel, and InfiniBand.2. Low-power consumption: The SY58030UMG-TR is designed to operate at low power, making it ideal for applications where power efficiency is critical, such as in portable devices or data centers where multiple chips are used.3. Low jitter performance: Jitter refers to the variation in timing of a signal, which can negatively impact data integrity and reliability. The chip incorporates low-jitter PLL technology to minimize data jitter and ensure reliable transmission over long distances.4. Small form factor: The chip is available in a compact 24-pin QFN package, allowing for easy integration into space-constrained designs.5. Wide temperature range: The SY58030UMG-TR can operate in a wide temperature range, typically from -40°C to 85°C, making it suitable for industrial and harsh environments.Application scenarios for the SY58030UMG-TR chip include:1. High-speed data communication: The chip can be used in data centers, networking equipment, and communication systems to transmit and receive high-speed data reliably and efficiently.2. Video transmission: With its high data rate support, low jitter, and low power consumption, the chip can be employed in applications involving video transmission, such as video surveillance, broadcast equipment, and video conferencing systems.3. Storage systems: The chip can be utilized in storage systems and servers where fast and reliable data transmission is crucial, such as in solid-state drives (SSDs) or RAID configurations.4. Test and measurement equipment: The SY58030UMG-TR can be integrated into high-speed test and measurement equipment, allowing for accurate and efficient data acquisition and analysis.Overall, the SY58030UMG-TR integrated circuit chip offers advantages in terms of high-speed data transmission, low-power consumption, low jitter performance, and small form factor, making it suitable for various applications requiring reliable and efficient data communication.
PI3CH401LE Relevant information