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PI3VT32X245BE

PI3VT32X245BE

Manufacturer No:

PI3VT32X245BE

Manufacturer:

Diodes Incorporated

Description:

IC BUS SWITCH 8 X 1:1 40BQSOP

Datasheet:

Datasheet

Delivery:

Payment:

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PI3VT32X245BE Specifications

  • Type
    Parameter
  • Supplier Device Package
    40-BQSOP
  • Package / Case
    40-FSOP (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    2.3V ~ 2.7V, 3V ~ 3.6V
  • Voltage Supply Source
    Single Supply
  • Current - Output High, Low
    -
  • Independent Circuits
    2
  • Circuit
    8 x 1:1
  • Type
    Bus Switch
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    -
The SSTVA16859AGT is a high-performance, low-power, 16-bit configurable multiple input/output (I/O) device. It offers several advantages and can be applied in various scenarios, including:1. Configurability: The IC chip allows the configuration of multiple I/O standards such as LVTTL, LVCMOS, HSTL, SSTL, and GTL. This flexibility enables the chip to interface with a wide range of digital devices, making it suitable for mixed-signal applications.2. High-Speed Data Transfer: The SSTVA16859AGT supports high-speed data transfer rates, making it well-suited for applications requiring quick data communication between different devices. It can be utilized in communication systems, networking equipment, and high-speed test and measurement applications.3. Low Power Consumption: The IC chip is designed to minimize power consumption, making it suitable for portable and battery-powered devices. It enables efficient energy usage without compromising performance, making it ideal for mobile devices, handheld instruments, and other power-constrained applications.4. ESD Protection: The SSTVA16859AGT provides robust Electrostatic Discharge (ESD) protection, ensuring reliable operation and protecting against damage from electrostatic events. This makes it suitable for applications where ESD protection is critical, such as industrial automation, automotive systems, and medical devices.5. Signal Integrity Enhancement: The chip incorporates features like output impedance control, slew rate control, and signal termination, which help improve signal integrity and reduce signal reflections. It can be used in applications requiring high signal integrity, such as high-speed interfaces, memory systems, and data centers.6. Industry Standard Compliance: The chip conforms to several industry standards, including JEDEC, JESD8, and EIA-644, ensuring compatibility with existing systems and facilitating easy integration into various applications.Overall, the SSTVA16859AGT IC chip offers configurability, high-speed data transfer, low power consumption, ESD protection, signal integrity enhancement, and industry-standard compliance. It can be applied in a wide range of scenarios, including mixed-signal interfaces, communication systems, portable devices, industrial automation, automotive systems, and high-speed data transfers.
PI3VT32X245BE Relevant information