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FSTD3306MTC Specifications
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TypeParameter
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Supplier Device Package8-TSSOP
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Package / Case8-TSSOP (0.173", 4.40mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C
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Voltage - Supply4.5V ~ 5.5V
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Voltage Supply SourceSingle Supply
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Current - Output High, Low-
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Independent Circuits2
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Circuit1 x 1:1
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TypeBus Switch
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PackagingTube
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Product StatusObsolete
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Series-
The QS34XVH2245Q3G integrated circuit chips offer several advantages and can be applied in various scenarios. Some of these advantages and application scenarios include:1. High-speed switching: The QS34XVH2245Q3G chips are designed for high-speed switching applications, which makes them suitable for use in data communications, telecommunications, and other bandwidth-intensive applications.2. Low power consumption: These chips have low power consumption, which helps in reducing energy consumption and extending battery life in portable electronics such as smartphones, tablets, and wearable devices.3. Wide voltage range support: The QS34XVH2245Q3G chips support a wide voltage range, making them compatible with different voltage levels used in various electronic systems.4. Bidirectional data transmission: These chips support bidirectional data transmission, enabling easy interfacing between different subsystems or devices in a system, such as connecting two different voltage domains or interconnecting different types of interfaces.5. ESD protection: The chips offer Electrostatic Discharge (ESD) protection, which helps in preventing damage to the integrated circuit due to electrostatic discharges. This protection is especially important in scenarios where the chips are exposed to electrostatic discharge risks, such as in industrial environments.6. Programmable features: The QS34XVH2245Q3G chips come with programmable features that allow customization according to specific application requirements. This flexibility makes them suitable for a wide range of applications.Some application scenarios for QS34XVH2245Q3G integrated circuit chips include:1. System-level interconnects: These chips can be used to enable bidirectional data transmission between different subsystems or devices in a system, such as connecting a microcontroller to a sensor or interfacing between different interfaces like I2C, SPI, and UART.2. Switching matrices: The QS34XVH2245Q3G chips can be utilized to build switching matrices or data routers, allowing flexible routing of data signals between different channels or ports.3. Signal level shifting: These chips can be employed for signal level shifting, where they enable the interfacing of devices operating at different voltage levels, such as connecting a low-voltage microcontroller to a higher-voltage sensor or peripheral.4. Bus interfacing: The chips can be used for interfacing with different bus standards like USB, SATA, or Ethernet, facilitating bidirectional communication between devices operating on these bus protocols.5. Test and measurement equipment: QS34XVH2245Q3G chips can be integrated into test and measurement equipment, providing the necessary data path switching functionality for signal routing or multiplexing in equipment such as oscilloscopes, logic analyzers, or data acquisition systems.Overall, the QS34XVH2245Q3G chips offer advantages like high-speed switching, low power consumption, wide voltage range support, and programmable features, making them suitable for various application scenarios that involve data communication, signal routing, and interfacing between different subsystems or devices.
FSTD3306MTC Relevant information