74FST3861DWR2

74FST3861DWR2

Manufacturer No:

74FST3861DWR2

Manufacturer:

onsemi

Description:

IC BUS SWITCH 10 X 1:1 24SOIC

Datasheet:

Datasheet

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74FST3861DWR2 Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-SOIC
  • Package / Case
    24-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    4V ~ 5.5V
  • Voltage Supply Source
    Single Supply
  • Current - Output High, Low
    -
  • Independent Circuits
    1
  • Circuit
    10 x 1:1
  • Type
    Bus Switch
  • Packaging
    Bulk
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    74FST
The SN74CBTK6800DWG4 is a specific integrated circuit chip manufactured by Texas Instruments. It is a 10-bit FET bus switch with level shifting capabilities. Here are some advantages and application scenarios of this chip:Advantages: 1. Level Shifting: The SN74CBTK6800DWG4 can shift voltage levels between different logic families, making it suitable for interfacing between devices with different voltage requirements. 2. Bidirectional Switching: It allows bidirectional signal flow, enabling communication between different parts of a system. 3. Low ON-State Resistance: The chip has low ON-state resistance, minimizing signal distortion and ensuring efficient signal transmission. 4. Wide Operating Voltage Range: It can operate within a wide voltage range, making it compatible with various systems and devices. 5. ESD Protection: The chip provides Electrostatic Discharge (ESD) protection, safeguarding the circuit from potential damage due to static electricity.Application Scenarios: 1. Level Shifting: The primary application of the SN74CBTK6800DWG4 is level shifting between different logic families. For example, it can be used to interface between a microcontroller operating at 3.3V and a peripheral device operating at 5V. 2. Bus Switching: It can be used to connect or disconnect multiple devices to a common bus, allowing for efficient data transfer between them. 3. Voltage Translation: The chip can be used to translate voltage levels between different parts of a system, ensuring compatibility and reliable communication. 4. Signal Routing: It can be used to route signals between different sections of a circuit, enabling flexible and controlled signal flow. 5. ESD Protection: The ESD protection feature of the chip makes it suitable for applications where static electricity discharge is a concern, such as in portable devices or industrial environments.It is important to note that the specific advantages and application scenarios may vary depending on the system requirements and the overall circuit design.