SN74CBTLVR16292LR
Manufacturer No:
SN74CBTLVR16292LR
Manufacturer:
Description:
IC MUX/DEMUX 12 X 1:2 56SSOP
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SN74CBTLVR16292LR Specifications
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TypeParameter
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Supplier Device Package56-SSOP
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Package / Case56-BSSOP (0.295", 7.50mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C
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Voltage - Supply2.3V ~ 3.6V
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Voltage Supply SourceSingle Supply
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Current - Output High, Low-
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Independent Circuits1
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Circuit12 x 1:2
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TypeMultiplexer/Demultiplexer
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusDiscontinued at Digi-Key
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Series74CBTLVR
The SN74CB3T3383DW is a specific model of integrated circuit chip developed and manufactured by Texas Instruments. It is a high-bandwidth switch that can be used in a wide range of applications. Some of the advantages and application scenarios of the SN74CB3T3383DW chipset are as follows:1. High-speed switching: This chip is designed to provide high-speed switching capability, making it ideal for applications where fast data transmission or signal routing is required.2. Low voltage operation: It operates at low voltages, typically between 1.4V to 3.6V, allowing it to be integrated into various low-power systems without the need for additional voltage level-shifting components.3. Low on-state resistance: The SN74CB3T3383DW chip offers low on-state resistance, enabling minimal signal distortion and improved signal integrity.4. Bi-directional functionality: It supports bi-directional data flow, allowing it to be used for bidirectional signal routing, multiplexing, or general-purpose switching of digital signals.5. Multiple switch configurations: This chip contains eight independent 1-bit switch elements, which can be combined to create various switch configurations based on the specific application requirements.6. Wide range of applications: The SN74CB3T3383DW chipset finds applications in various electronic systems, including communication equipment, audio/video routing, portable devices, industrial automation, data acquisition systems, and more.7. Package options: The chip is available in different package options, such as SOIC (Small Outline Integrated Circuit) and TSSOP (Thin Shrink Small Outline Package), allowing flexibility in board-level integration.Overall, the SN74CB3T3383DW integrated circuit chips offer high-speed switching, low voltage operation, and flexibility in a wide range of applications.
SN74CBTLVR16292LR Relevant information