SN74CBTK32245GKER
Manufacturer No:
SN74CBTK32245GKER
Manufacturer:
Description:
IC BUS SWITCH 8 X 1:1 96LFBGA
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SN74CBTK32245GKER Specifications
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TypeParameter
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Supplier Device Package96-LFBGA (13.5x5.5)
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Package / Case96-LFBGA
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C
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Voltage - Supply4.5V ~ 5.5V
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Voltage Supply SourceSingle Supply
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Current - Output High, Low-
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Independent Circuits4
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Circuit8 x 1:1
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TypeBus Switch
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PackagingBulk
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusObsolete
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Series74CBTK
The FST33X257QSPX is a specific integrated circuit (IC) chip from ON Semiconductor. These IC chips have several advantages and can be applied in various scenarios. Here are some of the advantages and potential application scenarios of the FST33X257QSPX:Advantages:1. High-speed operation: The IC chip supports high-speed data transmission, enabling fast and efficient communication between components.2. Low power consumption: The FST33X257QSPX is designed to consume minimal power, making it suitable for battery-powered devices or applications where power efficiency is essential.3. Low voltage operation: These IC chips can operate at low voltages, making them compatible with a wide range of systems and devices.4. High signal integrity: The FST33X257QSPX provides excellent signal integrity, ensuring reliable data transmission and communication with minimal noise or distortion.5. Small form factor: The IC chip comes in a compact package, allowing for easy integration into various devices and systems with limited space.Application Scenarios:1. Communication systems: The FST33X257QSPX can be used in communication systems that require high-speed, low-power data transmission. It can be applied in networking equipment, data centers, and telecom infrastructure.2. Consumer electronics: These IC chips can be utilized in consumer electronic devices such as smartphones, tablets, laptops, and portable media players to enable fast and efficient data communication.3. Industrial automation: The FST33X257QSPX can be employed in industrial automation systems for reliable and high-speed data exchange between various components, modules, or subsystems.4. Medical devices: Medical equipment often requires efficient data communication between different components or devices. The FST33X257QSPX can be used in such applications to ensure reliable and speedy data transmission.5. Automotive electronics: In automotive applications, the FST33X257QSPX can be used for communication between different modules, such as sensors, control units, and displays, ensuring fast and secure data exchange.These are just some potential advantages and application scenarios of the FST33X257QSPX IC chip. The specific implementation and usage may vary depending on the requirements of the system or device where it is utilized.
SN74CBTK32245GKER Relevant information