74HCT154DB,112

74HCT154DB,112

Manufacturer No:

74HCT154DB,112

Manufacturer:

Nexperia USA Inc.

Description:

IC DECODER/DEMUX 1X4:16 24SSOP

Datasheet:

Datasheet

Delivery:

Payment:

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74HCT154DB,112 Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-SSOP
  • Package / Case
    24-SSOP (0.209", 5.30mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply
    4.5V ~ 5.5V
  • Voltage Supply Source
    Single Supply
  • Current - Output High, Low
    4mA, 4mA
  • Independent Circuits
    1
  • Circuit
    1 x 4:16
  • Type
    Decoder/Demultiplexer
  • Packaging
    Tube
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    74HCT
The 74SSTVF16857PAG8 is a specific integrated circuit (IC) chip belonging to the SSTL-18 Class I family of devices. It is a 18-bit registered buffer designed to provide robust high-speed data buffering for various applications requiring low-voltage differential signaling (LVDS). Here are the advantages and application scenarios for this IC chip:Advantages: 1. High-speed data buffering: The 74SSTVF16857PAG8 is capable of operating at very high speeds, making it suitable for applications requiring fast data transmission and processing. 2. Robust LVDS signaling: LVDS is a low-power, low-noise signaling standard that enables high-speed data transmission over long distances. The IC chip is designed to comply with the SSTL-18 Class I electrical specification, ensuring reliable LVDS signaling performance. 3. 18-bit data width: With its 18-bit registered buffer, the chip can handle larger data widths, making it suitable for applications with higher data processing requirements.Application scenarios: 1. High-speed data interfaces: The 74SSTVF16857PAG8 can be used in various applications that require high-speed data buffering, such as communication systems, networking devices, and data storage systems. It facilitates data transfer between different parts of these systems. 2. Printed circuit board (PCB) routing: LVDS signaling is commonly used in PCB designs to transmit high-speed data between different components or subsystems. The IC chip can be deployed to buffer and route data signals before transmission, ensuring signal integrity and reducing noise. 3. Data acquisition systems: In applications where large amounts of data need to be acquired and processed in real-time, the IC chip can be utilized to buffer and transmit the data between sensors, analog-to-digital converters, and digital processing units.Overall, the 74SSTVF16857PAG8 IC chip offers high-speed data buffering and robust LVDS signaling capabilities, making it suitable for various applications that require reliable and efficient data transfer.