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DS25CP152QSQX/NOPB

DS25CP152QSQX/NOPB

Manufacturer No:

DS25CP152QSQX/NOPB

Manufacturer:

Texas Instruments

Description:

IC CROSSPOINT SW 1 X 2:2 16WQFN

Datasheet:

Datasheet

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DS25CP152QSQX/NOPB Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-WQFN (4x4)
  • Package / Case
    16-WFQFN Exposed Pad
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    3V ~ 3.6V
  • Voltage Supply Source
    Single Supply
  • Current - Output High, Low
    -
  • Independent Circuits
    1
  • Circuit
    1 x 2:2
  • Type
    Crosspoint Switch
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    Automotive, AEC-Q100
The ADG3245BRU is a high-performance, dual-supply, bidirectional level translator integrated circuit chip. It offers several advantages and can be used in various application scenarios. Some of the advantages and application scenarios of the ADG3245BRU are:Advantages: 1. Bidirectional Level Translation: The ADG3245BRU can translate logic levels between two different voltage domains, allowing communication between devices operating at different voltage levels. 2. High-Speed Operation: It supports high-speed data rates, making it suitable for applications requiring fast data transfer. 3. Low Power Consumption: The chip is designed to minimize power consumption, making it suitable for battery-powered devices or applications where power efficiency is crucial. 4. Wide Voltage Range: It supports a wide range of supply voltages, allowing compatibility with various systems and devices. 5. ESD Protection: The ADG3245BRU provides built-in electrostatic discharge (ESD) protection, safeguarding the chip and connected devices against damage from static electricity.Application Scenarios: 1. Mixed Voltage Systems: The ADG3245BRU is commonly used in systems where different components or subsystems operate at different voltage levels. It enables communication and data transfer between these components by translating the logic levels. 2. Interface Conversion: It can be used to convert logic levels between different interface standards, such as TTL (Transistor-Transistor Logic) and CMOS (Complementary Metal-Oxide-Semiconductor), allowing seamless integration of devices with different interface requirements. 3. Level Shifting: The chip can be used to shift logic levels up or down, enabling compatibility between devices with different voltage requirements. 4. I/O Expansion: It can be used to expand the number of input/output (I/O) pins available on a microcontroller or other integrated circuits, allowing connection to a larger number of devices or peripherals. 5. Communication Protocols: The ADG3245BRU can be used in various communication protocols, such as I2C, SPI, UART, or GPIO, to enable communication between devices operating at different voltage levels.Overall, the ADG3245BRU integrated circuit chip offers bidirectional level translation, high-speed operation, low power consumption, wide voltage range, and ESD protection. It finds applications in mixed voltage systems, interface conversion, level shifting, I/O expansion, and various communication protocols.
DS25CP152QSQX/NOPB Relevant information