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SN74CB3T3257DGVR

SN74CB3T3257DGVR

Manufacturer No:

SN74CB3T3257DGVR

Manufacturer:

Texas Instruments

Description:

IC MUX/DEMUX 4 X 2:1 16TVSOP

Datasheet:

Datasheet

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SN74CB3T3257DGVR Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TVSOP
  • Package / Case
    16-TFSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    2.3V ~ 3.6V
  • Voltage Supply Source
    Single Supply
  • Current - Output High, Low
    -
  • Independent Circuits
    1
  • Circuit
    4 x 2:1
  • Type
    Multiplexer/Demultiplexer
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74CB
The PI3VT34X245BE integrated circuit chips belong to the PI3VT34X series of voltage translation/bus switch ICs. Some advantages and application scenarios of these chips are as follows:Advantages: 1. Voltage Translation: The PI3VT34X245BE chips are designed for voltage translation between different voltage domains, enabling communication between devices operating at different voltage levels. 2. Bidirectional Signal Flow: These chips support bi-directional signal transmission, allowing signals to be easily translated between different voltage domains. 3. Low Power Consumption: They offer low power consumption, making them suitable for power-sensitive applications. 4. Fast Speed: The PI3VT34X245BE chips provide fast data transfer rates, enabling high-speed data communication between devices. 5. ESD Protection: These chips have built-in electrostatic discharge (ESD) protection, safeguarding the connected devices from any electrostatic damage.Application Scenarios: 1. Mixed Voltage Systems: PI3VT34X245BE chips are widely used in mixed voltage systems where multiple devices or subsystems operate at different voltage levels. These chips facilitate communication and data transfer between these systems. 2. Bi-directional Level Shifting: The chips are used for signal level shifting in applications where bidirectional data transmission is required between devices operating at different voltage levels. 3. I/O Expansion: PI3VT34X245BE chips can be utilized for expanding the input/output capabilities of microcontrollers or FPGAs. They allow these devices to interface with peripherals and sensors operating at different voltage levels. 4. Battery-Powered Devices: Due to their low power consumption, these chips are suitable for battery-powered devices such as smartphones, tablets, or portable gadgets, where power efficiency is crucial. 5. Communication Interfaces: They are commonly deployed in communication interfaces like UART, I2C, SPI, or USB, where voltage translation is required to ensure proper communication between devices with different voltage requirements.It's important to note that the specific advantages and application scenarios of the PI3VT34X245BE chips may vary based on the requirements and technical specifications of the target system or application.
SN74CB3T3257DGVR Relevant information