MAX3781UCM-D
Manufacturer No:
MAX3781UCM-D
Manufacturer:
Description:
MAX3781 2.75GBPS DUAL MUX/BUFFER
Datasheet:
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In Stock : 6900
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MAX3781UCM-D Specifications
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TypeParameter
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Supplier Device Package48-TQFP-EP (7x7)
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Package / Case48-TQFP Exposed Pad
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Mounting TypeSurface Mount
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Operating Temperature-
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Voltage - Supply3V ~ 3.6V
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Voltage Supply Source-
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Current - Output High, Low-
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Independent Circuits2
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Circuit2 x 1:1
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TypeMultiplexer
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PackagingBulk
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Product StatusActive
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Series-
The MAX3781UCM-D is an integrated circuit (IC) chip designed for laser drivers in fiber optic communication systems. Some advantages and application scenarios of this chip are:1. High-speed communication: The MAX3781UCM-D is designed to deliver high-speed laser modulation and control, enabling high-speed data transmission in fiber optic communication systems. It supports data rates up to 12.5 Gbps, making it suitable for high-bandwidth applications.2. Low power consumption: This IC chip is optimized for low power consumption, allowing energy-efficient operation in fiber optic systems. It offers a low-power standby mode when the laser is off or not in use, further conserving energy.3. Compact and integrated design: The MAX3781UCM-D incorporates multiple functions and features into a single chip, reducing the overall circuit complexity and component count. This integrated design saves board space and simplifies the manufacturing process.4. Wide operating temperature range: The chip operates reliably over a wide temperature range, typically from -40°C to +85°C. This makes it suitable for diverse application scenarios, including industrial, military, and harsh environments.5. Adaptive power control: The MAX3781UCM-D includes features like automatic power control (APC) and automatic temperature control (ATC). These features help maintain optimal laser power output and temperature stability, ensuring consistent performance.6. Compatible with various laser types: This IC chip is designed to work with multiple types of lasers, including distributed feedback (DFB) lasers and electro-absorption modulated lasers (EMLs). It provides flexibility in choosing the laser type based on specific application requirements.Some application scenarios where the MAX3781UCM-D can be utilized are:1. Optical communication systems: It can be used in fiber optic communication equipment, such as transceivers, multiplexers, and optical line terminals (OLTs). The chip's high-speed capability enables reliable transmission of data over long distances.2. Data centers: As data centers require high bandwidth and low latency communication, the MAX3781UCM-D can be used in optical interconnect solutions for efficient data transfer between servers and network switches.3. Telecommunications: The chip can be employed in telecommunications infrastructure, including long-haul and metro optical networks, to enable high-speed data transmission and efficient signal processing.4. Industrial applications: The chip's rugged design and wide temperature range make it suitable for industrial environments where reliable communication is required, such as in factory automation, process control, and monitoring systems.5. Military and aerospace applications: The chip's robustness, low power consumption, and temperature range make it suitable for military and aerospace applications where high-speed, reliable communication is critical.Overall, the MAX3781UCM-D IC chip offers advantages such as high-speed communication, low power consumption, compact design, wide temperature range, and compatibility with various laser types. It finds application in diverse scenarios, including optical communication systems, data centers, telecommunications, industrial automation, and military/aerospace systems.
MAX3781UCM-D Relevant information