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PI5C3257LEX

PI5C3257LEX

Manufacturer No:

PI5C3257LEX

Manufacturer:

Diodes Incorporated

Description:

IC MUX/DEMUX 4 X 2:1 16TSSOP

Datasheet:

Datasheet

Delivery:

Payment:

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PI5C3257LEX Specifications

  • Type
    Parameter
  • Supplier Device Package
    16-TSSOP
  • Package / Case
    16-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    4.75V ~ 5.25V
  • Voltage Supply Source
    Single Supply
  • Current - Output High, Low
    -
  • Independent Circuits
    1
  • Circuit
    4 x 2:1
  • Type
    Multiplexer/Demultiplexer
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    -
The NB100LVEP56DTR2G is a high-speed differential receiver integrated circuit chip designed for high-speed signal transmission. It has several advantages and application scenarios, including:1. High-speed transmission: The chip allows for high-speed data transmission with a maximum data rate of up to 3.8 Gbps. This makes it suitable for applications requiring fast signal processing such as data communication, networking, and high-speed serial interfaces.2. Low voltage differential signaling (LVDS): The chip is compatible with LVDS, which is a popular signaling standard used for high-speed data transmission over relatively long distances. It provides a low power and low noise solution for long-range signal transmission.3. Differential inputs: The chip has differential inputs that enable it to receive data signals with high common-mode noise rejection. This makes it ideal for applications where noise immunity is crucial, such as industrial automation, automotive systems, and medical equipment.4. Small form factor: The chip comes in a small form factor package (TSSOP-56), making it easy to integrate into small electronic systems. This is advantageous for space-constrained applications where size is a critical factor.5. ESD protection: The chip incorporates ESD (Electrostatic Discharge) protection, safeguarding it from potential damage due to electrostatic discharge events. This makes it suitable for applications where ESD protection is required, such as in portable devices or in environments with high ESD risks.Some application scenarios where NB100LVEP56DTR2G integrated circuit chips are commonly used include high-speed data transmission, networking equipment like routers and switches, communication systems, industrial automation, automotive electronics, and medical devices.
PI5C3257LEX Relevant information