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QS3L383SO

QS3L383SO

Manufacturer No:

QS3L383SO

Manufacturer:

Quality Semiconductor

Description:

IC BUS FET EXCHG SW

Datasheet:

Datasheet

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QS3L383SO Specifications

  • Type
    Parameter
  • Supplier Device Package
    -
  • Package / Case
    -
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    5V
  • Voltage Supply Source
    -
  • Current - Output High, Low
    -
  • Circuit
    -
  • Type
    Bus FET Exchange Switch
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    -
The SPC574S60E3CE0AY integrated circuit (IC) chip is a microcontroller unit (MCU) developed by NXP Semiconductors. It is specifically designed for automotive applications and offers several advantages and application scenarios:Advantages: 1. High Performance: The SPC574S60E3CE0AY chip is based on the Power Architecture? technology, providing a high-performance 32-bit MCU core. It operates at a clock frequency of up to 160 MHz, enabling fast and efficient processing of complex automotive applications.2. Enhanced Safety and Security: This chip incorporates advanced safety features, such as a dual-core lockstep architecture with hardware redundancy, memory protection units, and error correction codes. It also includes a security module for secure boot and cryptographic services, ensuring the integrity and confidentiality of automotive systems.3. Automotive-Grade Reliability: The SPC574S60E3CE0AY chip is designed to meet the stringent requirements of the automotive industry, including AEC-Q100 qualification. It offers high-temperature operation, robustness against electromagnetic interference, and long-term reliability, making it suitable for automotive applications in harsh environments.4. Extensive Peripheral Integration: The chip integrates a wide range of peripherals, including multiple CAN, LIN, and FlexRay interfaces, Ethernet, SPI, I2C, ADC, PWM, and more. This allows for seamless connectivity with various automotive systems and sensors, enabling efficient data exchange and control.Application Scenarios: 1. Advanced Driver Assistance Systems (ADAS): The SPC574S60E3CE0AY chip can be used in ADAS applications, such as adaptive cruise control, lane departure warning, and collision avoidance systems. Its high-performance processing capabilities and integrated peripherals enable real-time data processing and control for enhanced safety.2. Electric Powertrain Control: With its robustness and high-speed processing, this chip is suitable for controlling electric powertrains in electric vehicles (EVs) and hybrid electric vehicles (HEVs). It can handle complex algorithms for motor control, battery management, and regenerative braking, ensuring efficient and reliable operation.3. Body and Chassis Control: The SPC574S60E3CE0AY chip can be utilized in body and chassis control systems, including central body controllers, lighting control modules, and active suspension systems. Its extensive peripheral integration and safety features enable precise control and monitoring of various functions.4. Infotainment and Connectivity: This chip can also be employed in automotive infotainment systems, providing connectivity options like Ethernet and CAN interfaces for seamless integration with external devices. It can handle multimedia processing, communication protocols, and user interface control, enhancing the overall in-vehicle experience.Overall, the SPC574S60E3CE0AY chip offers high performance, safety, reliability, and extensive integration, making it suitable for a wide range of automotive applications.
QS3L383SO Relevant information