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SN74CBTLV3383PWR

SN74CBTLV3383PWR

Manufacturer No:

SN74CBTLV3383PWR

Manufacturer:

Texas Instruments

Description:

IC BUS FET EXCH SW 5X2:2 24TSSOP

Datasheet:

Datasheet

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Payment:

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SN74CBTLV3383PWR Specifications

  • Type
    Parameter
  • Supplier Device Package
    24-TSSOP
  • Package / Case
    24-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    2.3V ~ 3.6V
  • Voltage Supply Source
    Single Supply
  • Current - Output High, Low
    -
  • Independent Circuits
    1
  • Circuit
    5 x 2:2
  • Type
    Bus FET Exchange Switch
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74CBTLV
The 72V70800TFG integrated circuit (IC) chips are primarily designed for use in power management applications, offering various advantages and application scenarios. Here are some of the advantages and possible application scenarios for these chips:Advantages: 1. High voltage handling capability: The 72V70800TFG chips can handle high voltages up to 72V, making them suitable for applications requiring power management at higher voltage levels. 2. Integrated functionality: These chips provide several integrated functions such as voltage regulation, current regulation, protection mechanisms, and communication interfaces, reducing the need for external components and simplifying the overall system design. 3. Efficiency and power savings: With their advanced power management techniques and optimized circuitry, these chips can enhance the overall efficiency and power savings of the system. 4. Compact form factor: The chips are designed to be compact, enabling their use in space-constrained applications, such as portable devices or miniature power management systems.Application scenarios: 1. Industrial automation: The 72V70800TFG IC chips can be employed in industrial automation systems, where they can regulate and manage the power supply for various devices and subsystems. 2. Electric vehicles: With their capability to handle high voltages, these chips can be utilized in electric vehicle power management systems, controlling the charging and discharging of batteries and managing the power distribution within the vehicle. 3. Renewable energy systems: These chips are suitable for power management applications in solar energy, wind energy, or other renewable energy systems, where they can regulate and optimize the power generation, storage, and utilization. 4. Telecommunications infrastructure: The chips can be deployed in telecommunications infrastructure to manage power supplies for base stations, servers, and communication modules, ensuring efficient and reliable operation. 5. Consumer electronics: The compact size and integrated functionality of these chips make them beneficial for power management in consumer electronics such as smartphones, tablets, or wearable devices, improving efficiency and extending battery life.It's important to note that while the mentioned advantages and applications are common for these types of IC chips, the specific implementation and usage may vary depending on the system requirements and design choices.
SN74CBTLV3383PWR Relevant information