SN74CB3Q16244DGGR

SN74CB3Q16244DGGR

Manufacturer No:

SN74CB3Q16244DGGR

Manufacturer:

Texas Instruments

Description:

IC BUS SWITCH 4 X 1:1 48TSSOP

Datasheet:

Datasheet

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SN74CB3Q16244DGGR Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-TSSOP
  • Package / Case
    48-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Voltage - Supply
    2.3V ~ 3.6V
  • Voltage Supply Source
    Single Supply
  • Current - Output High, Low
    -
  • Independent Circuits
    4
  • Circuit
    4 x 1:1
  • Type
    Bus Switch
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74CB
The SN74CB3Q16244DGGR is a specific type of integrated circuit chip manufactured by Texas Instruments. It is a 16-bit high-bandwidth FET bus switch with 3-state outputs. Here are some advantages and application scenarios of this chip:Advantages: 1. High-bandwidth: The SN74CB3Q16244DGGR chip offers a high-bandwidth capability, making it suitable for applications that require fast data transfer rates. 2. Low power consumption: It is designed to operate with low power consumption, making it energy-efficient and suitable for battery-powered devices. 3. Wide voltage range: The chip supports a wide voltage range, allowing it to be used in various applications with different voltage requirements. 4. 3-state outputs: The 3-state outputs enable multiple devices to share a common bus, providing flexibility in system design.Application scenarios: 1. Data communication systems: The high-bandwidth capability of the SN74CB3Q16244DGGR chip makes it suitable for use in data communication systems, such as routers, switches, and network interface cards. 2. Portable devices: Due to its low power consumption, the chip can be used in portable devices like smartphones, tablets, and portable gaming consoles. 3. Industrial automation: The wide voltage range and 3-state outputs make the chip suitable for use in industrial automation systems, where multiple devices need to communicate over a shared bus. 4. Test and measurement equipment: The high-bandwidth and low power consumption features make the chip suitable for use in test and measurement equipment, such as oscilloscopes and logic analyzers.It is important to note that the specific advantages and application scenarios may vary depending on the requirements of the system and the overall design considerations.