74LVC1G157GM,132

74LVC1G157GM,132

Manufacturer No:

74LVC1G157GM,132

Manufacturer:

Nexperia USA Inc.

Description:

IC MULTIPLX 1 X 2:1 6XSON/SOT886

Datasheet:

Datasheet

Delivery:

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74LVC1G157GM,132 Specifications

  • Type
    Parameter
  • Supplier Device Package
    6-XSON, SOT886 (1.45x1)
  • Package / Case
    6-XFDFN
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Voltage - Supply
    1.65V ~ 5.5V
  • Voltage Supply Source
    Single Supply
  • Current - Output High, Low
    32mA, 32mA
  • Independent Circuits
    1
  • Circuit
    1 x 2:1
  • Type
    Multiplexer
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Active
  • Series
    74LVC
The 74LVC1G157GM,132 is a single 2-input multiplexer/demultiplexer chip manufactured by Nexperia. It has several advantages and application scenarios, including:Advantages: 1. Small form factor: The chip comes in a compact SOT753 (SC-88A) package, making it suitable for space-constrained applications. 2. Low power consumption: It operates at a low voltage range (1.65V to 5.5V) and consumes minimal power, making it energy-efficient. 3. High-speed operation: The chip provides fast switching times and propagation delays, making it suitable for applications that require quick signal routing. 4. Wide operating temperature range: It can operate across a wide temperature range (-40°C to 125°C), ensuring reliable performance in various environmental conditions. 5. ESD protection: The chip offers electrostatic discharge (ESD) protection up to 8 kV, safeguarding it against voltage spikes or transient events.Application Scenarios: 1. Signal routing and selection: The chip can be used as a multiplexer or demultiplexer to route or select signals from multiple inputs to a single output or vice versa. It is commonly used in data acquisition systems, telecom applications, or audio/video signal routing. 2. Level-shifting: It can be utilized to convert logic levels between different voltage domains, ensuring compatibility between various components in a system. This is often required when interfacing between different integrated circuits or when using components operating at different voltage levels. 3. I/O expansion: The chip can help expand the number of input/output ports of a microcontroller or microprocessor, enabling connectivity with additional peripheral devices. 4. Logic implementation: It can be employed in combinational logic circuits, such as encoding or decoding functions, where multiple inputs need to be combined or decoded to produce a desired output. 5. Battery-powered devices: The low power consumption and small form factor make it suitable for battery-powered devices where energy efficiency and compactness are crucial, such as portable consumer electronics or wearable devices.These are just a few examples of the advantages and application scenarios for the 74LVC1G157GM,132 integrated circuit chip. The specific implementation and utilization will depend on the requirements of the particular project or application.