M74HC573TTR

M74HC573TTR

Manufacturer No:

M74HC573TTR

Manufacturer:

STMicroelectronics

Description:

IC D-TYPE TRANSP SGL 8:8 20TSSOP

Datasheet:

Datasheet

Delivery:

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M74HC573TTR Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -55°C ~ 125°C
  • Current - Output High, Low
    7.8mA, 7.8mA
  • Delay Time - Propagation
    12ns
  • Independent Circuits
    1
  • Voltage - Supply
    2V ~ 6V
  • Output Type
    Tri-State
  • Circuit
    8:8
  • Logic Type
    D-Type Transparent Latch
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    74HC
The M74HC573TTR is a type of octal transparent latch integrated circuit chip. It has several advantages and application scenarios, including:Advantages: 1. High-performance and high-speed operation: The M74HC573TTR chip operates at a high speed, making it suitable for applications that require quick data transfer and latch control. 2. Easy input and output connections: It has standard input and output pins, making it compatible with various logic interface standards. 3. Low power consumption: The chip is designed to have low power consumption, making it suitable for battery-operated devices and energy-efficient applications. 4. Noise immunity: It offers good noise immunity, ensuring reliable operation even in environments with high electrical noise or interference. 5. Multiple package options: The chip comes in different package options, such as TSSOP, SO, and PDIP, providing flexibility for various design requirements.Application Scenarios: 1. Data storage and transfer: The M74HC573TTR is commonly used in applications where data needs to be temporarily stored in registers or latched for further processing. It can be used in microprocessors, microcontrollers, and other digital systems. 2. Address and control signal buffering: In systems with multiple address or control signals, the chip can be used to buffer and latch these signals to ensure proper timing and synchronization. 3. Bus interfacing: It can be employed as a buffer or latch for data and address buses in various digital systems, such as computers, communication devices, and industrial automation equipment. 4. Memory devices: The chip can be used in memory modules to latch or buffer address or control signals in RAM or ROM circuits. 5. I/O expansion: It can be utilized to expand the number of input or output pins in microcontrollers or other digital devices, enabling the connection of additional peripheral devices.Note: These advantages and applications are general in nature and may vary depending on the specific requirements of a given system or circuit design.