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SN74LVC373AQDWREP

SN74LVC373AQDWREP

Manufacturer No:

SN74LVC373AQDWREP

Manufacturer:

Texas Instruments

Description:

IC D-TYPE TRANSP SGL 8:8 20SOIC

Datasheet:

Datasheet

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SN74LVC373AQDWREP Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-SOIC
  • Package / Case
    20-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 125°C
  • Current - Output High, Low
    24mA, 24mA
  • Delay Time - Propagation
    1.5ns
  • Independent Circuits
    1
  • Voltage - Supply
    1.65V ~ 3.6V
  • Output Type
    Tri-State
  • Circuit
    8:8
  • Logic Type
    D-Type Transparent Latch
  • Packaging
    Cut Tape (CT)
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    74LVC
The SN74LVC373AQDWREP is a type of integrated circuit chip known as an octal transparent latch with 3-state outputs. Here are some advantages and application scenarios of this chip:Advantages: 1. High-speed operation: The chip is designed to operate at high speeds, making it suitable for applications requiring quick data transfer. 2. Low power consumption: The chip operates at low power levels, reducing energy consumption and increasing overall system efficiency. 3. Wide operating voltage range: The chip can operate within a wide voltage range, making it compatible with various power supply configurations. 4. 3-state outputs: The chip has 3-state outputs, meaning it can drive output signals to high impedance, enabling easy connection to other devices without interfering with their operation. 5. ESD protection: The chip offers electrostatic discharge (ESD) protection, guarding against potential damage during handling and operation.Application scenarios: 1. Data storage: The SN74LVC373AQDWREP chip is often used for temporary data storage in systems that require the latching of input data until the next clock cycle or until certain conditions are met. 2. Bus interface: The chip can be used as a bi-directional buffer or transceiver in systems where multiple devices need to share a common bus. Its 3-state outputs allow for easy connection and disconnection of devices to the bus. 3. Address decoding: The chip can be employed in address decoding circuits to translate address signals into chip select signals for memory devices or other components. 4. Control signal buffering: The chip can be utilized to buffer and distribute control signals within a system, ensuring proper timing and signal integrity. 5. Microcontroller applications: The chip can be integrated into microcontroller-based systems to interface with external devices, such as sensors, actuators, or display modules, enabling efficient data transfer and control.It's important to note that the specific application scenarios of the chip may vary depending on the requirements and specifications of the system being designed.
SN74LVC373AQDWREP Relevant information