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CY74FCT373CTQCTG4

CY74FCT373CTQCTG4

Manufacturer No:

CY74FCT373CTQCTG4

Manufacturer:

Texas Instruments

Description:

IC D-TYPE TRANSP SGL 8:8 20SSOP

Datasheet:

Datasheet

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CY74FCT373CTQCTG4 Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-SSOP
  • Package / Case
    20-SSOP (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Output High, Low
    32mA, 64mA
  • Delay Time - Propagation
    2ns
  • Independent Circuits
    1
  • Voltage - Supply
    4.75V ~ 5.25V
  • Output Type
    Tri-State
  • Circuit
    8:8
  • Logic Type
    D-Type Transparent Latch
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    74FCT
The CY74FCT373CTQCTG4 integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-speed operation: These chips are designed to operate at a high-speed frequency, allowing for quick data transfer and processing.2. Low power consumption: The CY74FCT373CTQCTG4 chips are designed to minimize power consumption, making them suitable for battery-powered devices and other low-power applications.3. Wide operating voltage range: These chips can operate at a wide range of supply voltages, providing flexibility in different applications.4. Schottky TTL-compatible inputs: The inputs of these chips are Schottky TTL-compatible, which ensures reliable interfacing with other TTL or CMOS devices.5. Output drive capability: These chips have a strong output drive capability, enabling them to drive long interconnects or multiple loads without degradation of signal quality.Application Scenarios: 1. Data storage and multiplexing: The CY74FCT373CTQCTG4 chips are commonly used for data storage and transfer in applications such as registers, latches, and data multiplexers.2. Memory interfacing: These chips can be used to interface with different types of memory devices, such as SRAM (Static Random Access Memory) and DRAM (Dynamic Random Access Memory).3. Bus and signal buffering: The high-speed operation and strong output drive capability of these chips make them suitable for buffering data and signals in high-speed bus systems, such as address buses or data buses in microprocessors.4. Communication systems: These chips can be used in communication systems for data buffering, synchronization, and interfacing between different components, such as transceivers or protocol converters.5. Industrial automation: The CY74FCT373CTQCTG4 chips are commonly used in industrial automation applications for data storage, control signal interfacing, and buffering in PLCs (Programmable Logic Controllers) or other control systems.6. Automotive electronics: These chips can be used in automotive electronics for various applications, including data storage, signal buffering, and interfacing in automotive control units or infotainment systems.It is important to note that the specific application scenarios may vary depending on the exact requirements and specifications of the given project or system.
CY74FCT373CTQCTG4 Relevant information