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CY74FCT2373TQCTG4

CY74FCT2373TQCTG4

Manufacturer No:

CY74FCT2373TQCTG4

Manufacturer:

Texas Instruments

Description:

IC D-TYPE TRANSP SGL 8:8 20SSOP

Datasheet:

Datasheet

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CY74FCT2373TQCTG4 Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-SSOP
  • Package / Case
    20-SSOP (0.154", 3.90mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Output High, Low
    15mA, 12mA
  • Delay Time - Propagation
    1.5ns
  • Independent Circuits
    1
  • Voltage - Supply
    4.75V ~ 5.25V
  • Output Type
    Tri-State
  • Circuit
    8:8
  • Logic Type
    D-Type Transparent Latch
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    74FCT
The CY74FCT2373TQCTG4 is a high-speed, low-power octal transparent latch integrated circuit chip. Some of its advantages and application scenarios include:Advantages: 1. High-speed operation: The CY74FCT2373TQCTG4 chip operates at a high-speed frequency, making it suitable for applications that require fast data transfer and processing. 2. Low power consumption: It is designed to consume low power, making it energy-efficient and suitable for battery-powered devices or applications where power efficiency is crucial. 3. Octal latch configuration: The chip has eight individual transparent latch circuits, allowing it to store and control eight separate data inputs simultaneously. 4. Wide operating voltage range: It can operate within a wide voltage range, typically from 4.5V to 5.5V, making it compatible with various power supply configurations.Application Scenarios: 1. Data storage and transfer: The CY74FCT2373TQCTG4 chip can be used in applications where data needs to be stored temporarily or transferred between different components or subsystems. 2. Address and data bus buffering: It can be used to buffer address and data buses in microprocessors or microcontrollers, ensuring reliable and efficient data transfer between different parts of a system. 3. Memory interfacing: The chip can be used to interface with various memory devices, such as RAM or ROM, providing control and data storage capabilities. 4. Digital signal processing: It can be used in digital signal processing applications, where high-speed data processing and manipulation are required. 5. Communication systems: The chip can be used in communication systems, such as networking equipment or data transmission devices, to handle data routing, buffering, and synchronization.It is important to note that the specific application scenarios may vary depending on the requirements and design of the overall system.
CY74FCT2373TQCTG4 Relevant information