MM74HCT373MTC

MM74HCT373MTC

Manufacturer No:

MM74HCT373MTC

Manufacturer:

onsemi

Description:

IC D-TYPE TRANSP SGL 8:8 20TSSOP

Datasheet:

Datasheet

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MM74HCT373MTC Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Output High, Low
    7.2mA, 7.2mA
  • Delay Time - Propagation
    25ns
  • Independent Circuits
    1
  • Voltage - Supply
    4.5V ~ 5.5V
  • Output Type
    Tri-State
  • Circuit
    8:8
  • Logic Type
    D-Type Transparent Latch
  • Packaging
    Tube
  • Packaging
    Tube
  • Product Status
    Obsolete
  • Series
    74HCT
The MM74HCT373MTC is a high-speed octal D-type latch integrated circuit chip. It has several advantages and application scenarios, including:Advantages: 1. High-speed operation: The MM74HCT373MTC chip operates at high speeds, making it suitable for applications that require fast data transfer and storage. 2. Low power consumption: It is designed to operate at low power, making it energy-efficient and suitable for battery-powered devices. 3. Compatibility: The chip is compatible with both TTL and CMOS logic levels, allowing it to be easily integrated into existing systems. 4. Output drive capability: It has a high output drive capability, enabling it to drive various loads without requiring additional buffer circuits. 5. Wide operating voltage range: The chip can operate within a wide voltage range, typically from 2V to 6V, making it versatile and suitable for different power supply configurations.Application scenarios: 1. Data storage: The MM74HCT373MTC chip can be used to store and latch data in various applications, such as memory systems, registers, and data buffers. 2. Data transfer: It can be used for data transfer between different parts of a system, such as between microcontrollers, memory modules, or input/output devices. 3. Address decoding: The chip can be used in address decoding circuits to select specific memory locations or peripheral devices based on the address lines. 4. Bus interfacing: It can be used to interface between different buses or systems, allowing data to be transferred between them. 5. State synchronization: The chip can be used to synchronize the state of different components in a system, ensuring proper timing and coordination.Overall, the MM74HCT373MTC chip's advantages of high-speed operation, low power consumption, compatibility, output drive capability, and wide operating voltage range make it suitable for various applications involving data storage, transfer, address decoding, bus interfacing, and state synchronization.