TC74LVX573FTEL

TC74LVX573FTEL

Manufacturer No:

TC74LVX573FTEL

Description:

IC D-TYPE TRANSP SGL 8:8 20TSSOP

Datasheet:

Datasheet

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TC74LVX573FTEL Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-TSSOP
  • Package / Case
    20-TSSOP (0.173", 4.40mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Output High, Low
    4mA, 4mA
  • Delay Time - Propagation
    5.9ns
  • Independent Circuits
    1
  • Voltage - Supply
    2V ~ 3.6V
  • Output Type
    Tri-State
  • Circuit
    8:8
  • Logic Type
    D-Type Transparent Latch
  • Packaging
    Tape & Reel (TR)
  • Product Status
    Obsolete
  • Series
    TC74LVX
The TC74LVX573FTEL is a specific type of integrated circuit chip, known as a D-type latch. Here are some advantages and application scenarios of this chip:Advantages: 1. Low power consumption: The TC74LVX573FTEL is designed to operate at low power levels, making it suitable for battery-powered devices or energy-efficient applications. 2. High-speed operation: This chip offers high-speed data transfer rates, enabling fast and efficient data processing. 3. Wide operating voltage range: The TC74LVX573FTEL can operate within a wide range of voltage levels, making it compatible with various systems and power supply configurations. 4. Small package size: The chip is available in compact packages, which is advantageous when designing space-constrained electronic devices. 5. Easy integration: It is easy to integrate the TC74LVX573FTEL chip into various electronic systems due to its compatibility with standard logic families.Application Scenarios: 1. Data storage and transfer: The TC74LVX573FTEL chip can be used to store and transfer digital information within electronic systems. It can function as a temporary storage element, allowing for efficient data handling. 2. Bus-oriented systems: The chip can be used in bus-oriented systems, such as data buses in computers or microcontrollers. It helps in transmitting and latching data onto the bus lines. 3. Logic-level translation: The TC74LVX573FTEL can translate logic levels between different voltage domains, enabling seamless communication between devices operating at different voltages. 4. Parallel-to-serial conversion: By connecting multiple TC74LVX573FTEL chips together, they can be used to perform parallel-to-serial conversion, where data from multiple inputs is serialized and transmitted over a single line. 5. Memory addressing: The chip can be utilized in memory addressing applications, controlling the addressing lines of memory devices, such as RAM or ROM chips, allowing for efficient reading or writing of data.These are just a few examples of how the TC74LVX573FTEL chip can be applied. The specific use cases depend on the requirements and design of the electronic system.