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CY74FCT573ATPC

CY74FCT573ATPC

Manufacturer No:

CY74FCT573ATPC

Manufacturer:

Texas Instruments

Description:

IC D-TYPE TRANSP SGL 8:8 20DIP

Datasheet:

Datasheet

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CY74FCT573ATPC Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-PDIP
  • Package / Case
    20-DIP (0.300", 7.62mm)
  • Mounting Type
    Through Hole
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Output High, Low
    32mA, 64mA
  • Delay Time - Propagation
    2ns
  • Independent Circuits
    1
  • Voltage - Supply
    4.75V ~ 5.25V
  • Output Type
    Tri-State
  • Circuit
    8:8
  • Logic Type
    D-Type Transparent Latch
  • Packaging
    Tube
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    74FCT
The CY74FCT573ATPC is a high-speed, low-power octal transparent latch integrated circuit chip. Some of its advantages and application scenarios include:Advantages: 1. High-speed operation: The CY74FCT573ATPC operates at a high-speed frequency, making it suitable for applications that require fast data transfer and processing. 2. Low power consumption: This chip is designed to consume low power, making it energy-efficient and suitable for battery-powered devices or applications where power consumption is a concern. 3. Wide operating voltage range: The chip can operate within a wide voltage range, typically from 4.5V to 5.5V, making it compatible with various power supply configurations. 4. ESD protection: The CY74FCT573ATPC provides built-in electrostatic discharge (ESD) protection, ensuring the chip's reliability and durability in harsh environments.Application Scenarios: 1. Data storage and transfer: The CY74FCT573ATPC can be used in applications where data needs to be stored and transferred between different components or subsystems. It can latch and hold data until it is ready to be transferred to another device or processed further. 2. Address and control signal buffering: The chip can be used to buffer address and control signals in microprocessors or digital systems. It ensures that the signals are stable and synchronized, preventing any data corruption or errors. 3. Bus interfacing: The CY74FCT573ATPC can be used to interface between different buses or subsystems in a digital system. It allows for the transfer of data between different components or subsystems, ensuring proper synchronization and data integrity. 4. Memory expansion: The chip can be used in memory expansion applications, where additional memory modules need to be added to a system. It can latch and hold the address and data signals, enabling the expansion of memory capacity. 5. Input/output (I/O) expansion: The CY74FCT573ATPC can be used to expand the number of I/O pins in a microcontroller or digital system. It allows for the connection of additional devices or peripherals, increasing the system's functionality.Overall, the CY74FCT573ATPC integrated circuit chip offers high-speed, low-power operation, making it suitable for various applications that require data storage, transfer, buffering, interfacing, and expansion.
CY74FCT573ATPC Relevant information