84067012A
Manufacturer No:
84067012A
Manufacturer:
Description:
IC BUFFER NON-INVERT 5.5V 20CLCC
Datasheet:
Delivery:
Payment:
In Stock : 170
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84067012A Specifications
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TypeParameter
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Supplier Device Package20-CLCC (8.89x8.89)
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Package / Case20-CLCC
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Mounting TypeSurface Mount
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Operating Temperature-55°C ~ 125°C (TA)
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Current - Output High, Low8mA, 8mA
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Delay Time - Propagation-
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Voltage - Supply4.5V ~ 5.5V
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Output TypeTri-State
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Circuit-
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Logic Type-
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PackagingBulk
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Product StatusActive
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Series-
Some advantages of the PIC18F25K20T-I/ML integrated circuit (IC) chips include:1. Low power consumption: These chips have a low power operating voltage range, making them suitable for energy-efficient applications.2. High performance: The PIC18F25K20T-I/ML chips are based on the PIC18 architecture, which offers high-speed performance and efficient processing capabilities.3. Integrated peripherals: These IC chips come with a variety of integrated peripherals, such as analog-to-digital converters (ADCs), pulse-width modulation (PWM) modules, timers, and serial communication interfaces. These peripherals make it easier to interface with various external devices.4. Large memory capacity: The PIC18F25K20T-I/ML chips have a large flash memory capacity, allowing for the storage of complex programs and data.5. Enhanced security features: These chips provide built-in hardware security features, including code protection and data encryption, which help safeguard the integrity of the system.Application scenarios where the PIC18F25K20T-I/ML IC chips can be used include:1. Industrial control systems: The high-performance and low-power characteristics of these chips make them suitable for various industrial control applications, such as motor control, power management, and sensor interfacing.2. Internet of Things (IoT) devices: With their integrated peripherals and large memory capacity, these chips can be used in IoT devices for data acquisition, sensor fusion, and wireless communication.3. Embedded systems: The PIC18F25K20T-I/ML chips find applications in embedded systems, including consumer electronics, home automation, medical devices, and automotive systems.4. Power management: The low power consumption of these chips makes them ideal for applications where power efficiency is crucial, such as battery-powered devices, portable electronics, and energy harvesting systems.5. Communication systems: With their built-in serial communication interfaces, these chips can be used in various communication systems, including wireless communication modules, telecommunications equipment, and networking devices.
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