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74FCT373ASC

74FCT373ASC

Manufacturer No:

74FCT373ASC

Manufacturer:

National Semiconductor

Description:

IC D-TYPE TRANSP SGL 8:8 20SOIC

Datasheet:

Datasheet

Delivery:

Payment:

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74FCT373ASC Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-SOIC
  • Package / Case
    20-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    0°C ~ 70°C
  • Current - Output High, Low
    15mA, 48mA
  • Delay Time - Propagation
    4ns
  • Independent Circuits
    1
  • Voltage - Supply
    4.75V ~ 5.25V
  • Output Type
    Tri-State, Non-Inverted
  • Circuit
    8:8
  • Logic Type
    D-Type Transparent Latch
  • Packaging
    Bulk
  • Product Status
    Obsolete
  • Series
    74FCT
The MB89637RPF-G-1252-BND is a specific model of integrated circuit chip manufactured by Fujitsu. While specific advantages and application scenarios may vary depending on the specific requirements and use cases, here are some general advantages and potential application scenarios for this chip:Advantages: 1. High Performance: The MB89637RPF-G-1252-BND chip is designed to deliver high performance with a 16-bit CISC architecture and a maximum operating frequency of 20 MHz. This makes it suitable for applications that require fast processing and execution of instructions.2. Integrated Peripherals: The chip comes with various integrated peripherals, including UART, I2C, SPI, and timers/counters. These integrated peripherals reduce the need for external components and simplify the overall system design.3. Low Power Consumption: The chip is designed to operate at low power, making it suitable for battery-powered or energy-efficient applications. It offers multiple power-saving modes, such as sleep mode and stop mode, to minimize power consumption during idle or low activity periods.4. Ample Memory: The MB89637RPF-G-1252-BND chip provides a significant amount of on-chip memory, including 32 KB of flash memory for program storage and 2 KB of RAM for data storage. This allows for the implementation of complex algorithms and data processing tasks.Application Scenarios: 1. Industrial Automation: The high performance and integrated peripherals of the chip make it suitable for various industrial automation applications. It can be used in programmable logic controllers (PLCs), motor control systems, and other control and monitoring systems.2. Consumer Electronics: The low power consumption and ample memory of the chip make it suitable for consumer electronics applications. It can be used in devices such as smart home controllers, wearable devices, and portable medical devices.3. Communication Systems: The chip's integrated peripherals, including UART, I2C, and SPI, make it suitable for communication systems. It can be used in applications such as data loggers, wireless sensor networks, and IoT devices.4. Automotive Electronics: The chip's high performance and robust design make it suitable for automotive electronics applications. It can be used in automotive control systems, engine management systems, and other automotive electronics modules.It's important to note that the specific advantages and application scenarios may vary depending on the requirements and specifications of the project. It is recommended to consult the datasheet and technical documentation provided by the manufacturer for detailed information and suitability for specific applications.
74FCT373ASC Relevant information