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CY74FCT16373CTPAC

CY74FCT16373CTPAC

Manufacturer No:

CY74FCT16373CTPAC

Description:

BUS DRIVER, FCT SERIES, 2 FUNC,

Datasheet:

Datasheet

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CY74FCT16373CTPAC Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-TSSOP
  • Package / Case
    48-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Output High, Low
    64mA, 32mA
  • Delay Time - Propagation
    2ns
  • Independent Circuits
    2
  • Voltage - Supply
    4.5V ~ 5.5V
  • Output Type
    Tri-State
  • Circuit
    8:8
  • Logic Type
    D-Type Transparent Latch
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    74FCT
The CY74FCT16373CTPAC is a 16-bit transparent latch integrated circuit chip. Some of the advantages and application scenarios of this chip are as follows:Advantages: 1. High-speed operation: The CY74FCT16373CTPAC chip operates at a high-speed clock frequency, making it suitable for applications that require fast data transfer and processing. 2. Low power consumption: This chip is designed to consume low power, making it suitable for battery-powered devices or applications where power efficiency is crucial. 3. Wide operating voltage range: The chip can operate within a wide voltage range, typically from 4.5V to 5.5V, allowing it to be used in various electronic systems. 4. 3-state outputs: The chip features 3-state outputs, which means that the outputs can be actively driven high, actively driven low, or in a high-impedance state. This feature enables easy interfacing with other devices and allows multiple chips to be connected together without causing conflicts.Application scenarios: 1. Data storage and transfer: The CY74FCT16373CTPAC chip can be used in applications where data needs to be stored temporarily or transferred between different parts of a system. It can act as a buffer or latch to hold data until it is needed or until it can be transferred to another component. 2. Address decoding: In systems that require address decoding, the chip can be used to latch and hold the decoded address signals. This allows the system to select and activate specific components or memory locations based on the decoded address. 3. Bus interfacing: The chip can be used to interface between different buses or subsystems in a larger electronic system. It can latch and hold data from one bus and transfer it to another bus, enabling communication and data exchange between different parts of the system. 4. Control signal generation: The chip can be used to generate control signals based on input data or other system conditions. It can latch and hold the control signals until they are needed to control other components or subsystems.Overall, the CY74FCT16373CTPAC chip offers high-speed operation, low power consumption, and versatile functionality, making it suitable for a wide range of applications that require data storage, transfer, address decoding, bus interfacing, or control signal generation.
CY74FCT16373CTPAC Relevant information