In Stock : 2500
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74LVT573MTCX Specifications
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TypeParameter
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Supplier Device Package20-TSSOP
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Package / Case20-TSSOP (0.173", 4.40mm Width)
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Mounting TypeSurface Mount
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Operating Temperature-40°C ~ 85°C
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Current - Output High, Low32mA, 64mA
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Delay Time - Propagation4.4ns
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Independent Circuits1
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Voltage - Supply2.7V ~ 3.6V
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Output TypeTri-State
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Circuit8:8
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Logic TypeD-Type Transparent Latch
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PackagingCut Tape (CT)
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PackagingTape & Reel (TR)
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Product StatusLast Time Buy
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Series74LVT
The DSPIC33FJ64GP802-E/SO integrated circuit chips have several advantages and application scenarios:Advantages: 1. High-performance: These chips are based on the dsPIC33F core, which offers high computational performance and efficient instruction execution. 2. Digital Signal Processing (DSP) capabilities: The chips have a wide range of DSP instructions and peripherals, making them suitable for applications that require real-time signal processing. 3. Enhanced connectivity: They feature various communication interfaces like UART, SPI, I2C, and CAN, enabling seamless integration with other devices and systems. 4. Rich set of peripherals: The chips come with a variety of peripherals such as timers, PWM modules, ADCs, and DACs, providing flexibility for different application requirements. 5. Low power consumption: They have power-saving features like multiple sleep modes and adjustable clock frequencies, making them suitable for battery-powered applications.Application Scenarios: 1. Motor Control: The DSPIC33FJ64GP802-E/SO chips are commonly used in motor control applications, such as industrial automation, robotics, and electric vehicles. Their high-performance DSP capabilities and PWM modules enable precise control of motor speed and torque. 2. Power Electronics: These chips are suitable for power electronics applications like inverters, power supplies, and energy management systems. The integrated ADCs and DACs facilitate accurate measurement and control of voltage and current. 3. Audio Processing: The DSP capabilities of these chips make them ideal for audio processing applications like audio effects, audio synthesis, and digital audio amplifiers. 4. Communication Systems: With their built-in communication interfaces, these chips can be used in various communication systems, including wireless sensor networks, IoT devices, and industrial control systems. 5. Medical Devices: The high computational performance and low power consumption of these chips make them suitable for medical devices like patient monitoring systems, medical imaging, and diagnostic equipment.Overall, the DSPIC33FJ64GP802-E/SO integrated circuit chips offer a combination of high-performance DSP capabilities, connectivity options, and power-saving features, making them versatile for a wide range of applications.
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