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CD74FCT373TM

CD74FCT373TM

Manufacturer No:

CD74FCT373TM

Manufacturer:

Harris Corporation

Description:

IC D-TYPE TRANSP SGL 8:8 20SOIC

Datasheet:

Datasheet

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CD74FCT373TM Specifications

  • Type
    Parameter
  • Supplier Device Package
    20-SOIC
  • Package / Case
    20-SOIC (0.295", 7.50mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Output High, Low
    15mA, 64mA
  • Delay Time - Propagation
    13ns
  • Independent Circuits
    1
  • Voltage - Supply
    4.75V ~ 5.25V
  • Output Type
    Tri-State
  • Circuit
    8:8
  • Logic Type
    D-Type Transparent Latch
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The CD74FCT373TM is a type of integrated circuit chip known as an octal transparent latch with 3-state outputs. It has several advantages and application scenarios, including:1. High-speed operation: The CD74FCT373TM chip operates at high speeds, making it suitable for applications that require fast data transfer and processing.2. 3-state outputs: The chip has 3-state outputs, which means that the outputs can be in three different states: high, low, or high impedance. This feature allows multiple devices to share a common bus, enabling efficient data communication.3. Transparent latch: The chip has a transparent latch design, which means that the input data is transferred to the outputs as soon as the latch enable signal is active. This feature is useful in applications where real-time data transfer is required.4. Wide operating voltage range: The CD74FCT373TM chip can operate within a wide voltage range, typically from 4.5V to 5.5V. This makes it compatible with various power supply systems.5. Noise immunity: The chip has built-in noise immunity features, such as hysteresis on the inputs, which helps to reduce the impact of noise and ensure reliable operation in noisy environments.Application scenarios for the CD74FCT373TM chip include:1. Data storage and transfer: The chip can be used in applications where data needs to be stored temporarily or transferred between different components or subsystems. It can be used in microprocessors, memory systems, and communication interfaces.2. Bus interfacing: The 3-state outputs of the chip make it suitable for bus interfacing applications. It can be used to connect multiple devices to a common bus, allowing them to communicate and share data efficiently.3. Real-time control systems: The transparent latch design of the chip makes it suitable for real-time control systems, where immediate response and data transfer are critical. It can be used in industrial automation, robotics, and other control applications.4. High-speed data processing: The high-speed operation of the chip makes it suitable for applications that require fast data processing, such as digital signal processing, image and video processing, and high-speed data communication systems.Overall, the CD74FCT373TM chip offers high-speed operation, 3-state outputs, and noise immunity, making it suitable for a wide range of applications that require efficient data storage, transfer, and processing.
CD74FCT373TM Relevant information