74FCT162373TPA

74FCT162373TPA

Manufacturer No:

74FCT162373TPA

Description:

FAST 16-BIT TRANSPARENT LATCHES

Datasheet:

Datasheet

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74FCT162373TPA Specifications

  • Type
    Parameter
  • Supplier Device Package
    48-TSSOP
  • Package / Case
    48-TFSOP (0.240", 6.10mm Width)
  • Mounting Type
    Surface Mount
  • Operating Temperature
    -40°C ~ 85°C
  • Current - Output High, Low
    24mA, 24mA
  • Delay Time - Propagation
    13ns
  • Independent Circuits
    2
  • Voltage - Supply
    4.5V ~ 5.5V
  • Output Type
    Tri-State
  • Circuit
    8:8
  • Logic Type
    D-Type Transparent Latch
  • Packaging
    Bulk
  • Product Status
    Active
  • Series
    -
The 74FCT162373TPA is a 16-bit transparent latch with 3-state outputs, which is a type of integrated circuit chip. Here are some advantages and application scenarios of this chip:Advantages: 1. High-speed operation: The 74FCT162373TPA chip operates at high speeds, making it suitable for applications that require fast data transfer and processing. 2. 3-state outputs: The chip has 3-state outputs, which means that the outputs can be disabled or put into a high-impedance state. This feature allows multiple chips to be connected together without causing conflicts or bus contention. 3. Transparent latch: The chip has a transparent latch design, which means that the input data is immediately transferred to the outputs when the latch enable signal is active. This makes it suitable for applications that require real-time data transfer.Application scenarios: 1. Data storage and transfer: The 74FCT162373TPA chip can be used in applications where data needs to be stored temporarily or transferred between different parts of a system. For example, it can be used in memory systems, data buses, or communication interfaces. 2. Address decoding: The chip can be used in address decoding circuits, where it helps in selecting specific memory locations or peripheral devices based on the address signals. 3. Bus interface: The chip can be used as a buffer or interface between different parts of a system, such as between a microprocessor and memory or between different modules of a digital system. 4. Control signal distribution: The chip can be used to distribute control signals to multiple devices or modules in a system, ensuring synchronized operation and preventing conflicts.Overall, the 74FCT162373TPA chip offers high-speed operation, 3-state outputs, and transparent latch functionality, making it suitable for various applications involving data storage, transfer, address decoding, bus interface, and control signal distribution.